1008 articles
2026-05-22
digitimes.com
2026-05-22
Amid the continued crowding-out effect of artificial intelligence (AI) demand, IC distributor WPG Holdings said memory shortages and rising prices are weakening end-product sales momentum, and forecast that smartphone and PC production will shift from flat growth to a decline in 2026.
2026-05-22
digitimes.com
2026-05-22
Microsoft is in early discussions to provide AI servers powered by its in-house Maia chips to Anthropic, deepening ties between the two companies as cloud providers race to reduce dependence on Nvidia hardware and secure a stronger position in the AI infrastructure market.
2026-05-22
digitimes.com
2026-05-22
Tata Group's semiconductor facility in Assam is expected to begin production soon, marking a significant milestone in India's push to build a domestic semiconductor manufacturing industry and strengthen its standing in global technology supply chains.
2026-05-22
digitimes.com
2026-05-22
Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through continued investment in its Arizona manufacturing operations.
2026-05-22
digitimes.com
2026-05-22
Samsung Electronics is reportedly preparing to shift more of its gallium nitride (GaN) power semiconductor strategy toward foundry services after struggling to secure customers for its own GaN devices and modules, according to The Elec.
2026-05-22
digitimes.com
2026-05-22
South Korea announced a national plan to raise domestic production of defense semiconductors to 50% by 2029, targeting heavy reliance on US and Taiwan supply chains to bolster national security. The initiative, unveiled at the 2026 Advanced Strategic Semiconductor Innovation Conference, covers research and development, manufacturing, ecosystem building and workforce training and follows the recent
2026-05-22
digitimes.com
2026-05-22
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce development in AI-driven chip technologies, promising global impacts on computing speed, energy efficiency, and applications from healthcare to transportation while strengthening US competitiveness and innovation globall
2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su pushed back against concerns of an AI bubble on May 22, saying demand is "absolutely real" and that the industry remains in an early phase of growth.
2026-05-22
digitimes.com
2026-05-22
Forcelead Technology said it expects stable operations through 2026 as it rolls out a touch-TDDI product and pursues new automotive display opportunities, a development with implications for global suppliers and aftermarket channels as automakers adopt more advanced cockpit features. The company aims to protect margins while expanding beyond its core display business.
2026-05-22
digitimes.com
2026-05-22
Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products, also known as discrete silicon capacitors (IPD), will begin small-volume shipments in the second quarter of 2026, making it the first supplier qualified for Intel's embedded multi-die interconnect bridge (EMIB) advanced
2026-05-22
digitimes.com
2026-05-22
Samsung Electronics chairman Lee Jae-yong quietly visited Taiwan on May 21 and met with MediaTek CEO Rick Tsai, according to semiconductor supply chain sources, in a move aimed at expanding Samsung's foundry business by securing another major customer after deals with Tesla and renewed work with AMD. Samsung declined to comment, and MediaTek had not issued an official response by press time.
2026-05-22
digitimes.com
2026-05-22
AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while also revealing a new strategic direction centered on anelevated fanout bridge(EFB)packaging ecosystem.
2026-05-22
digitimes.com
2026-05-22
Nanya Technology plans to raise 2026 capital expenditure above NT$52 billion (US$1.64 billion), with chairman Tzou Ming-jen saying the DRAM maker will accelerate new fab construction to capture AI-led memory demand. Equipment installation is scheduled to begin in the first quarter of 2027, followed by mass production in the second half.
2026-05-22
digitimes.com
2026-05-22
Samsung Electronics and its union signed a provisional agreement late at night, about an hour before a scheduled May 21 strike, averting an industry estimate of more than KRW100 trillion (approx. US$66.8 billion) in supply chain disruption. The deal eases an immediate labor crisis but leaves unresolved structural conflicts and rising personnel costs.
2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su said the company is satisfied with its current CoWoS supply from TSMC, while noting that memory has become another pressure point in the AI chip supply chain.
2026-05-22
digitimes.com
2026-05-22
Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers explore panel-based processes. Aaron Fellis, corporate VP and GM of dielectric atomic layer deposition (ALD) products at Lam Research, said leading chip firms are testing PLP in R&D or alliances and that several custome
2026-05-22
digitimes.com
2026-05-22
InPsytech, the intellectual property unit of Egis Technology Group, announced on May 21 that it hired a former Altera CEO and ex-Intel executive as a senior strategy adviser to support global market expansion and large-scale growth. The firm said the appointment aims to leverage the adviser's semiconductor leadership experience to guide worldwide strategy and help scale the company's business in i
2026-05-22
digitimes.com
2026-05-22
Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has entered customer validation and is expected to begin mass production in the second half of 2026, as AI chip demand drives a new wave of advanced packaging expansion.
2026-05-22
digitimes.com
2026-05-22
Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads. The hardware targets a narrow segment of service providers that operate premium, high-velocity token applications for select customer bases. While the architecture excels at rapid text decoding, its broader market
2026-05-22
digitimes.com
2026-05-22
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng