SCREEN Holdings: Record SPE orders and strong advanced packaging growth offset year-over-year sales decline - TradingView

SCREEN Holdings demonstrates strong growth momentum in its latest financial results, particularly in advanced packaging capabilities. While overall sales declined year-over-year, record orders and rob... Read original →

SCREEN Holdings’ record orders signal advanced packaging’s evolution from a peripheral process to a core growth engine in semiconductor manufacturing. Technically, this accelerates co-design between front-end and back-end flows, driving adoption of wafer-level packaging and hybrid bonding—forcing upstream material suppliers to upgrade dielectric and temporary bonding chemistries. Geopolitically, tightening U.S.-Japan-Netherlands export controls paradoxically boost demand for non-U.S. equipment in Taiwan, China, South Korea, and mainland China, where SCREEN benefits from Japan’s relatively neutral supply chain stance. Competitors like Applied Materials and Tokyo Electron will likely bolt on packaging capabilities, but their front-end focus creates a strategic gap SCREEN can exploit. Over the next 18 months, capex allocated to advanced packaging tools could exceed 25% of total equipment spending, offsetting slowdowns in logic fab expansions—especially if SCREEN secures deep integration into TSMC’s CoWoS or Samsung’s I-Cube ecosystems.