SCREEN Holdings: SPE order intake is strong and advanced packaging sales are set for 20% growth this year - TradingView

SCREEN Holdings, a leading global semiconductor packaging equipment manufacturer, has demonstrated strong market performance with robust order intake and significant growth in advanced packaging sales... Read original →

SCREEN Holdings’ surging order book signals that advanced packaging is shifting from a supporting process to a pivotal enabler of chip performance. Technically, its coater-developer tools are increasingly integrated with hybrid bonding and RDL flows, forcing materials suppliers to accelerate low-k dielectric and high-resolution photoresist development while compelling OSATs to reconfigure fabs. Geopolitically, tightening U.S.-Japan-Netherlands export controls offer short-term localization tailwinds but raise receivables risk if customers in Taiwan, China or mainland China delay capacity expansions due to compliance hurdles. Competitively, Tokyo Electron will likely fast-track Fan-Out and Chiplet integration offerings, while ASML may leverage High-NA EUV to encroach on back-end processes. Over the next 18 months, capex for advanced packaging equipment could exceed 25% of total fab investment—SCREEN’s strategic alignment with TSMC’s CoWoS and Intel’s Foveros ecosystems positions it to lead this AI-driven ‘packaging arms race.’