Infineon launches EasyPACK S module and packaging concept - Semiconductor Today

At the recent PCIM Europe 2026 exhibition in Nuremberg, Germany, Infineon Technologies introduced the EasyPACK S power module and packaging concept, tailored for high-power-density applications in inc... Read original →

Infineon’s EasyPACK S isn’t just a packaging upgrade—it redefines system-level integration logic for power electronics. Its 5.6mm profile directly addresses spatial constraints in AI data centers and EV onboard chargers, shifting thermal management from module-centric to system-optimized via DBC substrates and 175°C-tolerant materials, forcing upstream suppliers to accelerate high-thermal-conductivity silicones and ceramic substrates. Amid the EU’s Net-Zero Industry Act pushing localized supply chains, EasyPACK S’s SiC/GaN scalability mitigates geopolitical disruption risks but raises entry barriers for smaller players. STMicroelectronics and onsemi will likely fast-track miniaturization of ACEPACK or PowerStack platforms, possibly partnering with Taiwan, China foundries for alternatives. Within 18 months, a standards battle over compact high-density modules will erupt—those mastering automated assembly and heterogeneous die integration will dominate 800V EV and liquid-cooled AI power markets.