Intel has started to strengthen its foundry (semiconductor consignment production) business by recru.. - 매일경제

Intel is accelerating the restructuring of its foundry business amid growing competition in the AI semiconductor market, particularly focusing on advanced packaging technologies that are becoming crit... Read original →

Intel’s elevation of advanced packaging to strategic priority reflects a reactive pivot to AI-driven system-level integration. Appointing Lee Seok-hee isn’t mere reshuffling—it’s a bid to vertically integrate 14A logic, HBM memory, and EMIB-T/HBI interconnects, directly challenging SK Hynix’s HBM ecosystem leverage and reducing reliance on Taiwan, China foundries. While U.S. CHIPS Act subsidies help, domestic manufacturing mandates inflate costs, and EUV export controls constrain capacity ramp. Samsung will likely accelerate GAA transistor adoption and 3nm yield improvements, leveraging HBM4 standard-setting as counterplay. Over the next 18 months, advanced packaging will define foundry competitiveness in AI; failure to deliver monolithic HBM+CPU+NIC packages by 2027 could relegate Intel Foundry to second-tier status.