Semiconductor News & Analysis Feed

As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components and Technology Conference described a shift in which Intel, Marvell, TSMC, and others detailed new packaging approaches as packages themselves begin hitting limits.

INTEL • LATEST NEWS Intel makes Advanced Packaging its own foundry focus: former SK hynix chief to scale EMIB-T and HBI 20. June 2026 06:00Samir Bashir 📖 Reading time: approx. 7 minutes · 1,308 words · 8,649 characters A modern AI chip is no longer simply a single piece of silicon. It is a densely packed system of compute chiplets, HBM, I/O dies, networking components, and power delivery. Anyone

INTEL • LATEST NEWS Intel makes Advanced Packaging its own foundry focus: former SK hynix chief to scale EMIB-T and HBI 20. June 2026 06:00Samir Bashir 📖 Reading time: approx. 7 minutes · 1,308 words · 8,649 characters A modern AI chip is no longer simply a single piece of silicon. It is a densely packed system of compute chiplets, HBM, I/O dies, networking components, and power delivery. Anyone

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