Samsung Electronics Surpasses $1 Billion HBM4 Sales - 조선일보

Samsung Electronics has achieved a significant milestone in the high-bandwidth memory (HBM4) market, with sales surpassing $1 billion, marking the first time such a feat has been accomplished in the i... Read original →

Samsung’s $1B HBM4 milestone stems from its integrated 4nm EUV base-die and advanced packaging, forcing EDA and TSV suppliers to accelerate roadmaps while nudging NVIDIA and hyperscalers toward early HBM4 adoption to avoid 2027 shortages. Amid tightening U.S.-led export controls on lithography tools, Samsung’s domestic EUV capacity offers partial supply-chain insulation—though its U.S. equipment exposure remains higher than SK Hynix’s. In response, SK Hynix may fast-track HBM4+ with Intel and Taiwan, China foundries, while Micron leverages CHIPS Act subsidies to push CPO architectures. With HBM pricing set to surge in 2027 and AI capex rising, Samsung is on track to overtake SK Hynix in market share—but North American cloud giants are quietly qualifying second sources to mitigate single-supplier risk under geopolitical volatility.