Samsung, SK Hynix to build new chip cluster, boost packaging and NAND capacity - KED Global

South Korea unveiled a monumental $591 billion semiconductor investment plan, marking a significant strategic move to strengthen its global semiconductor position. The initiative encompasses new memor... Read original →

South Korea’s $591 billion semiconductor initiative is a strategic pivot to fortify its memory dominance through advanced packaging and NAND expansion. Technologically, it will accelerate upstream adoption of hybrid bonding and downstream shift toward chiplet-based AI designs. Geopolitical friction between the U.S. and China imposes hidden costs: tighter export controls on EUV tools and talent restrictions may delay ramp-up timelines for Samsung and SK Hynix. In response, TSMC is likely to fast-track CoWoS capacity to undercut Korean HBM integration advantages, while Micron leverages CHIPS Act subsidies to scale 1β-node DRAM. Over the next 12–24 months, this move will compress the memory pricing cycle and spur parallel advanced packaging ecosystems in Taiwan, China and mainland China, fragmenting the global supply chain into competing technological blocs.