Semiconductor News & Analysis Feed

20 articles

2026-08-24

Porcelain Glaze Base Market Growth Driven by Semiconductor Packaging Demand Through 2035 - News and Statistics - IndexBox

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www.indexbox.io 2026-08-24

2026-08-24

Micron Says AI’s Memory Wall is Worsening as Compute outruns HBM Bandwidth by 3x every Two Years, Advanced Packaging & Process To Tackle Rising Thermal Constraints - Wccftech

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wccftech.com 2026-08-24

2026-08-23

AMD Is Investing More Than $10 Billion in Taiwan to Build Advanced Chip Packaging With TSMC. Here's What Lisa Su Is Actually Buying With That Money. - The Motley Fool

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www.fool.com 2026-08-23

2026-08-23

Kraft-Polyethylene Laminate Papers Market Semiconductor Packaging Demand Drives 3.5-5.5% CAGR Through 2035 - IndexBox

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www.indexbox.io 2026-08-23

2026-08-23

Glass Substrates Emerge as Chip Battleground; Korea's HBM Lead Hinges on Packaging - Seoul Economic Daily

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en.sedaily.com 2026-08-23

2026-08-22

Moisture-Vapor-Transmitting Laminate Market to Reach 190 Index by 2035 on Semiconductor Packaging Demand - IndexBox

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www.indexbox.io 2026-08-22

2026-08-22

Onto Innovation’s 80% Packaging Growth Masks a Lithography Problem - Dr. Robert Castellano's Semiconductor Deep Dive Newsletter

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drrobertcastellano.substack.com 2026-08-22

2026-08-22

Rapidus Targets 8-Reticle Interposers on 600 mm Advanced Packaging Panels by 2030 - TechPowerUp

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www.techpowerup.com 2026-08-22

2026-08-21

LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained

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tomshardware.com 2026-08-21

LG Electronics has entered the semiconductor packaging arena by signing a contract with an outsourced semiconductor assembly and test (OSAT) company to supply a maskless laser direct imaging (LDI) lithography tool. This technology enables the creation of metal interconnect patterns in chip packaging

Chip Packaging Laser Direct Imaging Semiconductor Equipment OSAT LG Electronics TSMC CoWoS EMIB

2026-08-21

LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained — maskless machine is designed to pattern fine interconnects, trading resolution for higher throughput - Tom's Hardware

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www.tomshardware.com 2026-08-21

2026-08-21

Micron commits $10 billion to new US-based Research Labs — Boise hub to target post-DRAM and NAND technologies and packaging - Tom's Hardware

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www.tomshardware.com 2026-08-21

2026-08-21

Bonding Pads Market to Reach Index 193 by 2035 on 5G and AI-Driven Advanced Packaging Demand - IndexBox

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www.indexbox.io 2026-08-21

2026-08-21

JCET's H1 net profit surges 79% on advanced packaging and AI demand - finance.biggo.com

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finance.biggo.com 2026-08-21

2026-08-21

JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

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digitimes.com 2026-08-21

2026-08-21

JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging

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digitimes.com 2026-08-21

2026-08-21

Kenmec surges on AI, advanced packaging to record orders, revenue - digitimes

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www.digitimes.com 2026-08-21

2026-08-20

JCET Reports 79.4% YoY Growth in H1 2026 Net Profit Attributable to Shareholders, Accelerates Advanced Packaging Expansion - TradingView

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www.tradingview.com 2026-08-20

2026-08-20

JCET Reports 79.4% YoY Growth in H1 2026 Net Profit Attributable to Shareholders, Accelerates Advanced Packaging Expansion - Morningstar

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www.morningstar.com 2026-08-20

2026-08-20

JCET Reports 79.4% YoY Growth in H1 2026 Net Profit Attributable to Shareholders, Accelerates Advanced Packaging Expansion - PR Newswire

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www.prnewswire.com 2026-08-20

2026-08-20

JCET Group : H1 2026 saw strong profit and revenue growth, led by AI and advanced packaging demand - TradingView

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www.tradingview.com 2026-08-20

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