SK hynix debuts iHBM to cut HBM heat and ready rollout from HBM5 - CHOSUNBIZ - Chosunbiz

SK hynix has unveiled its next-generation high bandwidth memory (HBM) technology, iHBM, aimed at addressing the heat dissipation challenges associated with increasing AI computing performance. By embe... Read original →

SK hynix’s iHBM marks a strategic pivot: shifting thermal management from system-level to package-level, compelling the entire AI chip stack—including TSMC’s CoWoS and Intel’s Foveros—to redesign interconnects for lower thermal resistance. With the EU advancing carbon taxes on high-power data centers, integrated cooling like ICE may become a regulatory necessity, raising barriers for smaller players. Samsung’s focus on TSV density in HBM4E overlooks the D2D PHY thermal bottleneck, risking competitiveness at HBM5. Within 18 months, the HBM race will pivot from bandwidth to thermal efficiency; firms mastering ICE integration with MR-MUF wafer-level packaging will dictate AI memory pricing, while those clinging to legacy cooling face marginalization in premium segments.