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[News] Samsung, NVIDIA Deepen Ties as Talks Reportedly Expand to HBM5 Next Year and Next-Gen Groq Chips 2026-06-09 Semiconductors editor News Please note that this article cites information from The Chosun Daily, Seoul Economic Daily, ZDNet, Yonhap News, Newspim, and Dealsite. Following Jensen Huang’s high-profile meetings with SK hynix during his South Korea visit, Samsung Electronics V

Samsung Electronics signaled that discussions on cooperation with Nvidia are progressing smoothly, and that collaboration in next-generation memory and foundry services will continue to expand. The comment was made by Samsung Electronics co-CEO and head of the Device Solutions (DS) division Young-hyun Jun following talks with Nvidia CEO Jensen Huang and senior executives at The Shilla hotel in Jun

Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei, pairing the eighth-generation AI memory with a new in-package cooling structure.

By  Choi Hyo-jung Published 2026.06.02. 18:07 Updated 2026.06.03. 00:39 Samsung Electronics and SK hynix moved to compete for leadership over high-bandwidth memory (HBM), which has emerged as a core component in the age of artificial intelligence (AI), at Computex 2026, Asia's largest IT and computing trade show, in Taipei, Taiwan. Samsung Electronics highlighted its technological competitiveness

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By Allen Lee Published: May 27 2026, 11:27 AM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket A visitor takes a picture of a model of SK hynix's high-bandwidth memory (HBM) technology during the 2025 World IT Show in Seoul on April 24, 2025. South Korean chip giant SK hynix reported record quarterly profits on April 24, thanks to soaring

By Allen Lee Published: May 27 2026, 11:27 AM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket A visitor takes a picture of a model of SK hynix's high-bandwidth memory (HBM) technology during the 2025 World IT Show in Seoul on April 24, 2025. South Korean chip giant SK hynix reported record quarterly profits on April 24, thanks to soaring

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By  Hwang Min-gyu Published 2026.05.26. 09:13 A concept diagram of iHBM technology released by SK hynix. /Courtesy of SK hynix SK hynix unveiled next-generation technology that reduces heat by inserting a cooling element inside a high bandwidth memory (HBM) package. On the 26th, SK hynix said it introduced "iHBM," a technology that embeds an integrated cooling element, ICE, in an HBM package. IC