The EU Bids to Catch Samsung and SK hynix, and May Have to Lean on Them - Tech Times

The European Union unveiled its revised Chips Act 2.0 in June 2026, aiming to revitalize its semiconductor industry with a proposed €120 billion investment by 2035. However, analysts highlight a parad... Read original →

The EU’s Chips Act 2.0 reveals a critical gap: lacking both 3nm EUV fabs and OSAT infrastructure, Brussels must lean on Samsung and SK hynix to achieve tech sovereignty. This dependency will reshape AI chip supply chains—Korean firms gain advanced packaging footholds in Europe, but face higher capex due to localization mandates in subsidy rules. Intel may exploit this geopolitical opening to expand logic chip dominance, while TSMC (Taiwan, China) risks exclusion from the US-led Pax Silica alliance. Within 18 months, if the EU fails to build an ecosystem for EUV maintenance and HBM-integrated packaging, its AI chip autonomy pledge will ring hollow, deepening covert reliance on Asian manufacturing.