Semiconductor News & Analysis Feed

India Prime Minister Narendra Modi inaugurated CG Semi's Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat, marking the start of commercial production at what the government described as the country's third semiconductor plant to become operational in 2026. The project forms part of New Delhi's broader effort to build a domestic semiconductor ecosystem under its India S

Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since late 2025, outsourced semiconductor assembly and test, or OSAT, capacity has tightened steadily. New capacity added in 2026 has also been filled quickly, prompting multiple IC design houses to lock in capacity and pus

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNewsand Yonhapreported.

Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of 24 tracked companies posting positive year-over-year gains, according to monthly revenue filings compiled for the period. The results underscore continued downstream demand driven by AI-related chip shipments and a broader recovery in consumer electronics.

As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMESbelieves that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP develo

The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers and supply chains, the shift suggests stronger demand for Taiwan's packaging and testing firms, alongside a broader rebalancing of semiconductor production.

This article first appeared in The Edge Malaysia Weekly on June 1, 2026 - June 7, 2026 FOR years, outsourced semiconductor assembly and test (OSAT) providers were viewed as the lower-margin, labour-intensive end of the semiconductor value chain — far removed from the prestige of chip design and wafer fabrication. As artificial intelligence (AI), electric vehicles, data centres and high-performan

JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing, power modules, and next-generation data centers.

US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only after 2028 as the US OSAT ecosystem gradually takes shape.

New High-speed Laser Marker delivers 2.5x higher chip throughput (units per hour) in a 22% smaller footprint, helping Outsourced Semiconductor Assembly & Test (OSAT) manufacturers drive productivity of valuable production floor space SINGAPORE, May 26, 2026 /PRNewswire/ -- IDI Dynamics, a subsidiary of ISDN Holdings Limited (SGX: I07 / 1656.HK), has launched its next generation High-speed Laser M

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