Semiconductor News & Analysis Feed
20 articles
2026-08-17
rcrwireless.com
2026-08-17
2026-08-17
www.cxodigitalpulse.com
2026-08-17
Indian fabless semiconductor company Level Five Cartronics is exploring partnerships with domestic OSAT (outsourced semiconductor assembly and testing) providers to advance its automotive chip manufacturing. The company has initiated discussions with several Indian OSAT firms, including CG Semi, Kay
2026-08-15
blogs.nvidia.com
2026-08-15
On August 14, 2026, Universitas Gadjah Mada (UGM), Indosat Ooredoo Hutchison (IOH), and NVIDIA launched Indonesia’s first university-based AI technology center, the UGM Indosat NVIDIA AI Technology Center (NVAITC), aimed at developing local AI talent through world-class infrastructure and educationa
2026-08-07
2026-08-06
www.nokia.com
2026-08-06
On August 6, 2026, Indosat Ooredoo Hutchison (IOH) partnered with Ooredoo Group, Nokia, and NVIDIA to launch Zankore, a full-stack AI infrastructure platform aimed at serving Southeast Asia. The initiative targets 1 gigawatt (GW) of NVIDIA DSX AI Factory capacity, positioning Indonesia as a regional
2026-08-06
2026-08-05
www.trendforce.com
2026-08-05
TrendForce reports that TSMC is expanding outsourcing of key CoWoS front-end processes to OSATs amid surging demand from NVIDIA and ASIC markets. CoWoS technology is crucial for advanced packaging, particularly for high-performance computing chips used in AI and data center applications. As NVIDIA m
2026-08-03
2026-08-03
2026-08-03
2026-07-29
marklapedus.substack.com
2026-07-29
2026-07-27
2026-07-17
www.digitimes.com
2026-07-17
2026-07-16
2026-07-15
2026-07-01
2026-06-23
2026-06-12
2026-06-11
www.klsescreener.com
2026-06-11
As AI, electric vehicles, data centers, and high-performance computing drive demand for increasingly powerful chips, advanced packaging has emerged as a critical bottleneck in semiconductor manufacturing. Once considered a commoditized back-end process, OSAT is now a strategic layer in the industry.
2026-05-26
en.prnasia.com
2026-05-26
IDI Dynamics, a subsidiary of ISDN Holdings, has launched a next-generation high-speed laser marking system designed to enhance productivity in semiconductor assembly and test (OSAT) operations. The device achieves 2.5x higher marking speed while occupying 22% less floor space, significantly improvi