TSMC Partners With Ibiden and Innolux to Advance Glass Substrate Packaging Technology; CoPoS Advanced Packaging Validation Data Revealed for the First Time - TradingKey

TSMC has partnered with Ibiden and Innolux to advance glass substrate technology for its next-generation CoPoS (Chip-on-Panel-on-Substrate) advanced packaging. This shift from wafer-level to panel-lev... Read original →

TSMC’s collaboration with Ibiden and Innolux on glass substrates signals a strategic pivot from wafer-level to panel-level advanced packaging. This move pressures upstream material suppliers to deliver ultra-thin, high-uniformity glass and forces equipment makers to overhaul TGV copper-filling and laser drilling processes. Geopolitically, reliance on U.S.-Japan glass supply chains elevates operational risk—any tightening of EUV-related export controls could delay CoPoS ramp. Samsung may accelerate FOPLP development in response, while Intel could double down on its Glass Core consortium. Over the next 12–24 months, AI chipmakers like NVIDIA and AMD will likely redesign chiplets for glass compatibility, and display manufacturers will leverage this entry point to build a ‘display-plus-packaging’ moat in the semiconductor value chain.