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TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time t

TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.