Semiconductor News & Analysis Feed

3 articles
2026-09-22
www.eetimes.com 2026-09-22
2026-09-22
www.digitimes.com 2026-09-22
GUC's 16 Gbps HBM4E IP on TSMC's N2P node marks a pivotal step in the HBM interface IP ecosystem, signaling that memory bandwidth scaling is now tightly coupled with leading-edge logic processes and advanced packaging. The jump from 12 Gbps on N3P to 16 Gbps on N2P underscores how quickly the HBM ro
2026-06-18
wccftech.com 2026-06-18
SK Hynix has initiated sampling of its next-generation high-bandwidth memory (HBM4E), offering up to 48GB capacity and 16Gbps data transfer speeds. This development comes amid a surge in demand for AI chips, which is pushing DRAM manufacturers to accelerate their R&D timelines. SK Hynix is racing ag