Semiconductor News & Analysis Feed

Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly developing an advanced packaging technology similar to Intel's Embedded Multi-die Interconnect Bridge (EMIB), according to The Information, which cited two sources familiar with the project. The collaboration involves substrate maker Ki

AMD has unveiled its sixth-generation EPYC 9006 server CPU and Instinct MI455X GPU, expanding its AI portfolio across agentic AI, cloud computing, enterprise, and HPC. The MI455X integrates 320 billion transistors using advanced packaging technologies like TSMC’s CoWoS-L and SoIC, built on 2nm and 3