xenospectrum.com
2026-09-11
Kepler Computing unveiled a novel ferroelectric AI memory technology on September 9, 2026, targeting the memory bottlenecks in current AI infrastructure. By combining ferroelectric materials with 3D stacking, the company achieves up to 10x the capacity of HBM without relying on advanced EUV lithogra
www.trendforce.com
2026-06-22
According to reports from Commercial Times and Economic Daily News, TSMC has reportedly cut 28nm wafer output by over 25% since early 2026, aligning with its accelerated push toward advanced node production. The primary 28nm facility, Fab 15A, saw monthly wafer starts drop from approximately 200,000