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NIST has demonstrated a metal 3D printing method that stirs molten metal during the print by sending the laser along looping elliptical paths instead of straight lines.

3D printing metal additive manufacturing laser sintering alloying materials science additive manufacturing NIST high-entropy alloys

Rohm SCT4013DLL 750 V SiC MOSFET: AI-ready power device for modern data centers - AD HOC NEWS

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www.ad-hoc-news.de 2026-06-12 AD HOC NEWS

Rohm, JP3982800009 Rohm SCT4013DLL 750 V SiC MOSFET: AI-ready power device for modern data centers 12.06.2026 - 15:54:08 | ad-hoc-news.de Rohm's SCT4013DLL 750 V SiC MOSFET targets high-efficiency, high-voltage power stages in AI server battery backup units and industrial systems, combining low loss, compact packaging and robust reliability for demanding data center and power applications. Rohm

SiC MOSFET Data Center AI Server Power Device Silicon Carbide High Voltage Power Conversion Energy Efficiency Power Management

Cadence, Samsung Foundry Expand 2nm and 3D‑IC Platform Partnership - EE Times India

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news.google.com 2026-06-12 EE Times India

Cadence, Samsung Foundry Expand 2nm and 3D‑IC Platform Partnership - EE Times Asia

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news.google.com 2026-06-12 EE Times Asia

SK Hynix readies 375-layer NAND as US listing plan advances

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digitimes.com 2026-06-12

SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead with a broader capacity buildout and moving toward a US listing as early as August.

Samsung Collaborations On 2nm And 3D‑IC Put Investor Focus On Valuation - Yahoo Finance

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finance.yahoo.com 2026-06-12 Yahoo Finance

Samsung Collaborations On 2nm And 3D‑IC Put Investor Focus On Valuation Simply Wall St Thu, June 11, 2026 at 10:10 AM PDT 2 min read 005930.KS -1.16% SNPS -1.47% CDNS +0.09% Explore stocks on Coinbase Trading disclosure Get insights on thousands of stocks from the global community of over 7 million individual investors at Simply Wall St. Samsung Electronics has expanded its collaborations with S

Samsung Electronics Semiconductor Manufacturing 2nm Process 3D-IC Technology Synopsys Collaboration Cadence Partnership AI Chips High-Performance Computing

Open-Source RISC-V GPU Vortex 3.0 Adds Full 3D Pipeline, Vulkan, ASIC Flows - Tech Times

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www.techtimes.com 2026-06-11 Tech Times

By Kyle Belmonte Published: Jun 10 2026, 14:07 PM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket Vortex VORTEX.CC.GATECH.EDU Georgia Tech released Vortex 3.0 on June 9, 2026, completing what may be the most capable openly synthesizable GPU in existence: a RISC-V-based design that now pairs a full fixed-function 3D graphics pipeline wit

Open Source GPU RISC-V Vulkan 3D Graphics Pipeline ASIC Flow Machine Learning Acceleration Texture Units Rasterizer

3D-printed triaxial electrospray nozzles could revolutionize drug and self-healing material manufacturing

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tomshardware.com 2026-06-10 Bruno Ferreira

New nozzle array design is better and far cheaper than conventional technology.

3D printing electrospray nozzles drug manufacturing self-healing materials MIT research microfluidics nanomanufacturing biosensors

Vortex 3.0 Released As Full-Stack, Open-Source RISC-V GPU Now With 3D Pipeline - Phoronix

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www.phoronix.com 2026-06-09 Phoronix

Vortex 3.0 Released As Full-Stack, Open-Source RISC-V GPU Now With 3D Pipeline Written by Michael Larabel in Hardware on 9 June 2026 at 06:02 AM EDT. Add A Comment The open-source developers at Georgia Tech working on Vortex as an OpenCL-compatible RISC-V GPGPU implementation are out with their next major release for this open-source GPU design. Vortex continues to consist of an open-source simul

RISC-V open-source GPU Vortex 3D pipeline GPGPU FPGA OpenCL Mesa

Cadence and Samsung Foundry Deepen 2nm and 3D IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand - megabites.com.ph

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www.megabites.com.ph 2026-06-08 megabites.com.ph

Cadence and Samsung Foundry announced a full portfolio of Memory and Interface IP, along with expanded certification of Cadence’s agentic AI digital, custom, 3D IC, and system design and analysis (SDA) flows for Samsung Foundry’s second-generation 2nm process. This collaboration delivers a signoff-ready platform for next-generation AI infrastructure and physical AI designs across data center, edge

Semiconductor Manufacturing AI Chip Design 2nm Process 3D Integration IP Licensing AI Infrastructure Physical AI Chip Design Tools

NVIDIA’s New RTX Spark Superchip Changes Everything for On-the-Go 12K Video Editing and 3D Rendering - Canon Rumors

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www.canonrumors.com 2026-06-08 Canon Rumors

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NVIDIA RTX Spark Mobile Computing Video Editing 3D Rendering Semiconductor Chips GPU Technology Cloud Computing

Cadence and Samsung Foundry deepen 2nm and 3D‑IC collaboration to meet surging AI infrastructure and physical AI demand - Manila Standard

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manilastandard.net 2026-06-08 Manila Standard

TECHNOLOGY Last updated June 8, 2026, 2:15 PM Cadence and Samsung Foundry deepen 2nm and 3D‑IC collaboration to meet surging AI infrastructure and physical AI demand By Manila Standard - Tech June 8, 2026, 2:15 PM Share Resize Text:16px Estimated reading time: 8 minutes and 8 seconds Multi-year agreement expands Memory, NVIDIA NVLink-C2C and advanced Interface IP, and agentic AI-optimized GPU‑ac

Semiconductor Manufacturing AI Chips 2nm Process 3D IC EDA Tools Chip Design NVIDIA Samsung Foundry

JCET opens 3D packaging plant to target AI power modules, CPO demand

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digitimes.com 2026-06-07

JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing, power modules, and next-generation data centers.

Synopsys’ 3DIC Push: Can Advanced Chip Complexity Fuel The Next Leg? - Smartkarma

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www.smartkarma.com 2026-06-07 Smartkarma

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3DIC technology chip design semiconductor supply chain EDA tools advanced process chip complexity technological innovation semiconductor equipment

Cadence and Samsung Foundry Expand 2nm & 3D-IC Collaboration For AI Infrastructure Development - Pokde.Net

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pokde.net 2026-06-06 Pokde.Net

Pokde.Net > System > Industrial > Cadence and Samsung Foundry Expand 2nm & 3D-IC Collaboration For AI Infrastructure Development INDUSTRIAL NEWS SYSTEM Cadence and Samsung Foundry Expand 2nm & 3D-IC Collaboration For AI Infrastructure Development Last updated: June 6, 2026 11:37 pm By Low Boon Shen Share 3 Min Read Cadence and Samsung Foundry have announced an expanded multi-year collaboration fo

Semiconductor AI Infrastructure 2nm Process 3D-IC Chip Design Foundry Collaboration Cadence Samsung Foundry

UT Researchers Use 3D Printing to Develop “Tabletop EUV Lithography” Process - 3DPrint.com

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3dprint.com 2026-06-05 3DPrint.com

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