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2026-06-06
pokde.net
2026-06-06
Pokde.Net
Pokde.Net > System > Industrial > Cadence and Samsung Foundry Expand 2nm & 3D-IC Collaboration For AI Infrastructure Development
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Cadence and Samsung Foundry Expand 2nm & 3D-IC Collaboration For AI Infrastructure Development
Last updated: June 6, 2026 11:37 pm
By
Low Boon Shen
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Cadence and Samsung Foundry have announced an expanded multi-year collaboration fo
2026-05-31
www.thelec.net
2026-05-31
thelec.net
SemiFive sets up a booth at SAFE Forum 2026 held at Samsung Electronics' US office on May 28. (Photo: SemiFive)
Brandon Cho, chief executive officer of SemiFive, presented the company's "Advanced 3D-IC and Big Die Solutions for AI Innovation" at Samsung Electronics' SAFE Forum 2026 held on May 28 in the US.
Application-specific integrated circuit (ASIC) design based on 3D-IC technology verticall
2026-05-29
www.prnewswire.com
2026-05-29
PR Newswire
SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE™ Forum 2026
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SEMIFIVE
May 28, 2026, 18:03 ET
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SAN JOSE, Calif., May 28, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, today announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE™) Fo
2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
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