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Socionext announced that it would develop a high-performance compute chiplet using TSMC's A14 process technology, positioning the project as a platform for next-generation custom silicon aimed at AI data center infrastructure.

AMD's Zen 7 'Grimlock' CPUs will reportedly utilize TSMC's 1.4nm 'A14' node and advanced packaging The company is also looking to integrate Powertech's FOPLP advanced packaging technology into the Zen 7 architecture, along with next-gen 3D V-Cache. VIEW GALLERY - 3 Hassam Nasir Tech Reporter Published May 25, 2026 2:50 PM CDT 2 minutes & 30 seconds read time TL;DR: AMD is preparing its Zen 7 "Grim

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Published: May 25, 2026 | Source: Taiwan Commercial Times | Author: Mark Campbell AMD Zen 7 Details Leak – “Grimlock” to use TSMC A14 node AMD has big plans for Zen 7 – More cores, more cache, and TSMC A14 silicon AMD is reportedly planning to use TSMC’s A14 lithography node for its Zen 7 “Grimlock” desktop CPUs. The Taiwan Commercial Times has reported that AMD is already preparing its supply c

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[News] AMD Zen 7 Reportedly Built on TSMC A14 Node as Powertech’s FOPLP Packaging Said to Be Under Evaluation 2026-05-25 Semiconductors editor News Please note that this article cites information from Commercial Times and TweakTown. With the CEOs of AMD and NVIDIA arriving in Taiwan back-to-back ahead of COMPUTEX in early June, their visits to key supply chain partners for next-generatio

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