Semiconductor News & Analysis Feed
87 articles
2026-07-07
tomshardware.com
2026-07-07
Etiido Uko
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
2026-07-05
digitimes.com
2026-07-05
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth me
2026-07-05
news.google.com
2026-07-05
IndexBox
2026-07-03
www.newelectronics.co.uk
2026-07-03
New Electronics
2026-07-03
www.electronicsweekly.com
2026-07-03
Electronics Weekly
2026-07-02
www.electronicsweekly.com
2026-07-02
Electronics Weekly
2026-07-02
www.digitimes.com
2026-07-02
digitimes
2026-07-02
digitimes.com
2026-07-02
Socionext announced that it would develop a high-performance compute chiplet using TSMC's A14 process technology, positioning the project as a platform for next-generation custom silicon aimed at AI data center infrastructure.
2026-07-01
semiengineering.com
2026-07-01
Semiconductor Engineering
2026-07-01
semiengineering.com
2026-07-01
Ann Mutschler
In next-generation silicon, AI can interpret system behavior at scale, but only if obse...
2026-06-29
www.allaboutcircuits.com
2026-06-29
All About Circuits
www.allaboutcircuits.com
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2026-06-29
www.digitaltoday.co.kr
2026-06-29
디지털투데이
Industry
Applied Materials expands packaging equipment lineup to boost HBM, chiplet yields
AI Summary
Applied Materials unveiled six new semiconductor manufacturing tools spanning advanced packaging and DRAM processes, the company said on Sunday. It said AI computing faces a “memory wall” as bandwidth and capacity lag growing model sizes and data throughput, driving demand for high-bandwidth memo
2026-06-28
vietnamnet.vn
2026-06-28
Báo VietNamNet
As Vietnam strengthens its policy framework, legal foundation, national strategy and science and technology programs for the semiconductor industry, one question remains: how can the country move further up the global semiconductor value chain?
From a practical perspective, turning chip designs into fully manufactured integrated circuits still faces significant obstacles.
According to the Minist
2026-06-27
digitimes.com
2026-06-27
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
2026-06-25
semiengineering.com
2026-06-25
Semiconductor Engineering
In Part 1, we looked at the innovations underpinning the Cerebras WSE-3 and why its most significant breakthrough is the elimination of data movement overhead at the architectural level, not better yield management or thermal engineering. Cerebras’ on-wafer fabric is a viable answer to the question being asked by the entire industry: how do you move data fast enough that compute stops waiting?
Th
2026-06-25
www.indexbox.io
2026-06-25
IndexBox
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2026-06-23
www.igorslab.de
2026-06-23
igor´sLAB
INTEL • LATEST NEWS
Leak: Intel-NVIDIA-SoC “Serpent Lake” is said to arrive in early 2028 – so far, only the RTX chiplet is confirmed
23. June 2026 06:00Samir Bashir
📖 Reading time: approx. 7 minutes · 1,380 words · 8,851 characters
Intel processor, NVIDIA graphics, and perhaps a handheld device around it as well — apparently nothing more is needed to keep the rumor mill supplied for two years. A
2026-06-23
www.igorslab.de
2026-06-23
igor´sLAB
INTEL • LATEST NEWS
Leak: Intel-NVIDIA-SoC “Serpent Lake” is said to arrive in early 2028 – so far, only the RTX chiplet is confirmed
23. June 2026 06:00Samir Bashir
📖 Reading time: approx. 7 minutes · 1,380 words · 8,851 characters
Intel processor, NVIDIA graphics, and perhaps a handheld device around it as well — apparently nothing more is needed to keep the rumor mill supplied for two years. A
2026-06-21
simplywall.st
2026-06-21
simplywall.st
United States/Software/NasdaqGM:AIP
Arteris (AIP) Is Up 7.6% After Highlighting AI Chiplet Role And Rising Institutional Ownership
June 21, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
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Recently, Arteris highlighted its role as a key provider of network-on-chip interconnect IP for increasingly complex AI-focused semiconductors and automotive systems, underlining how its technolog
2026-06-18
evertiq.com
2026-06-18
Evertiq
© Imec
General | June 18, 2026
Imec unlocks system-level III-V chiplet integration on Si-CMOS
Evertiq
By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems.
Imec, a Belgium-based research and innovation cen