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2026-06-04
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SK Group, TSMC Agree to Strengthen Ties in HBM, Advanced Packaging
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2026/06/04 09:36 CST
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SK Group Chairman Chey Tae-won met with Taiwan Semiconductor Manufac
2026-06-04
www.aastocks.com
2026-06-04
AASTOCKS.com
SK Group Chairman Chey Tae-won met with Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) Chairman C.C. Wei. The two sides exchanged views on the development of next-generation AI technologies and agreed to further strengthen comprehensive cooperation, including joint research and development of next-generation high bandwidth memory (HBM) and advanced packaging technologies, in order t
2026-06-04
biz.chosun.com
2026-06-04
Chosunbiz
By
Lee Ho-jun
Published 2026.06.04. 09:59
HANMI Semiconductor sets up a booth at the 2026 Computex exhibition. /Courtesy of HANMI Semiconductor
HANMI Semiconductor took part in Taiwan's Computex for the first time and showcased High Bandwidth Memory (HBM) production equipment and next-generation packaging equipment.
HANMI Semiconductor said on the 4th that it participated in "Computex 2026," he
2026-06-04
www.newswire.com
2026-06-04
newswire.com
Vadzo Imaging Announces NIR LED Array Board Integration Service for Uniform Illumination in Biometric, Inspection, and Day-Night Vision Applications
PRESS RELEASE • JUN 3, 2026 16:00 UTC
Vadzo Imaging introduces an OEM engineering program that combines precision configured NIR LED array boards with a portfolio of monochrome NIR camera products spanning MIPI, USB 3.0 and GigE interfaces. The servi
2026-06-03
seekingalpha.com
2026-06-03
Seeking Alpha
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2026-06-03
letsdatascience.com
2026-06-03
Let's Data Science
INFRASTRUCTURE
amkor
advanced packaging
osat
chips act
Amkor Technology Trades Cheap Despite AI Packaging Importance
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June 3, 2026
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Seeking Alpha reports that Amkor Technology (AMKR) trades at about 2.35x forward revenue and, in the article's thesis, is growing at 27.5% year-over-year, positioning
2026-06-03
www.thelec.net
2026-06-03
thelec.net
Genesem says orders for HBM and advanced packaging equipment are becoming increasingly visible as the market expands. (Photo: THE ELEC)
Genesem said on Monday that orders for advanced packaging equipment are becoming increasingly visible as demand rises in the high-bandwidth memory (HBM) and advanced semiconductor packaging markets.
The company recently completed development of next-generation p
2026-06-03
www.bitget.com
2026-06-03
Bitget
Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.
Sunshine Silver Mine restarts operations as market rebounds, with rising antimony demand adding a new highlight to performance
Netflix leverages AI to help users cope with content ov
2026-06-03
www.digitimes.com
2026-06-03
digitimes
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level packaging into panel-level packaging, according to ICviews and...
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2026-06-03
www.quiverquant.com
2026-06-03
Quiver Quantitative
Amkor Technology (AMKR) is up 6.2% today. Here is some analysis on what might have caused this price movement.
Analysis: AMKR’s move appears tied to a mix of ongoing investor optimism around advanced packaging demand and company-specific momentum from recent disclosures about expanding its Arizona footprint and deepening work with large chip customers. The rally may also be getting an extra push
2026-06-03
www.tradingview.com
2026-06-03
TradingView
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2026-06-02
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2026-06-02
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2026-06-02
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2026-06-02
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2026-06-02
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2026-06-02
ymcinema.com
2026-06-02
Y.M.Cinema
ymcinema.com
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2026-06-02
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Every era of computing is defined by the infrastructur
2026-06-02
news.google.com
2026-06-02
EE Times Asia
2026-06-02
www.digitimes.com
2026-06-02
digitimes
Intel's foundry revival may depend less on beating TSMC at the most advanced process nodes than on whether it can turn AI-driven demand into a profitable advanced packaging business.
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2026-06-02
www.digitimes.com
2026-06-02
digitimes
Nvidia CEO Jensen Huang has repeatedly backed TSMC's price hikes, saying its advanced process and supply-chain services are difficult and highly valuable. As AI chip demand surges, TSMC, Samsung Electronics, SK Hynix, Micron, and other top semiconductor...
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