Semiconductor News & Analysis Feed
621 articles
2026-05-29
www.thestar.com.my
2026-05-29
thestar.com.my
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2026-05-29
www.reuters.com
2026-05-29
Reuters
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2026-05-29
www.tradingview.com
2026-05-29
TradingView
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2026-05-29
eu.36kr.com
2026-05-29
eu.36kr.com
IC Coder uses AI to solve pain points in chip verification and seeks financing
蔡杰涛
2026-05-29 17:13
Chengdu Pengye Jiantu Technology enters the chip design and verification process with IC Coder, attempting to use AI Agent to reconstruct the inefficient links in the front-end R & D of FPGA and digital IC.
The Chip Design and Verification Stage Remains a Bottleneck for R&D Efficiency
There has
2026-05-29
www.moomoo.com
2026-05-29
Moomoo
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2026-05-29
asia.nikkei.com
2026-05-29
Nikkei Asia
Move a win for US chip titan as it looks to secure customers for foundry services
Mediatek says it is now "one of the few" chip designers able to support customers using advanced packaging technologies from both Taiwan Semiconductor Manufacturing Co. and Intel. (Source photos by Cheng Ting-Fang and Reuters)
TAIPEI -- MediaTek says it has started working with Intel for advanced chip packaging in
2026-05-29
www.digitimes.com
2026-05-29
digitimes
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.
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2026-05-29
www.thelec.net
2026-05-29
thelec.net
Innometri signs a memorandum of understanding with LaserCell to jointly develop non-destructive semiconductor inspection equipment. (Photo: Innometri)
Innometri said it signed a memorandum of understanding with LaserCell to jointly develop non-destructive semiconductor inspection equipment.
The two companies will cooperate on developing X-ray and computed tomography (CT) systems capable of inspe
2026-05-29
digitimes.com
2026-05-29
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.
2026-05-29
digitimes.com
2026-05-29
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.
2026-05-29
digitimes.com
2026-05-29
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging as key names to watch. Supply-chain sources say the shift could reshape who captures future demand for advanced packaging.
2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
digitimes.com
2026-05-29
Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa, as the electronics manufacturer looks beyond AI servers for its next phase of growth.
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
www.technetbooks.com
2026-05-29
Technetbook
Home News
Intel Fellow Ravi Mahajan on how EMIB and Advanced Packaging Drive Modern AI Computing
Intel Foundry Advanced Packaging Evolution and EMIB Development for Artificial Intelligence Workloads and Future Semiconductor Architecture Solutions
The semiconductor industry is at a turning point where shrinking transistors is no longer sufficient to support the massive computational power needed
2026-05-28
www.tradingview.com
2026-05-28
TradingView
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2026-05-28
markets.financialcontent.com
2026-05-28
FinancialContent
Vadzo Imaging Launches Falcon-830CRH: Onsemi AR0830 8MP Color USB 3.2 Gen 1 Camera with VCM Autofocus for Embedded Vision
By:
ACCESS Newswire
May 28, 2026 at 10:30 AM EDT
ⓘ This article is third-party content and does not represent the views of this site. We make no guarantees regarding its accuracy or completeness.
Vadzo Imaging's Falcon-830CRH is an 8MP 4K color USB camera powered by the Onsemi
2026-05-28
news.google.com
2026-05-28
Business Wire
2026-05-28
finance.yahoo.com
2026-05-28
Yahoo Finance
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2026-05-28
www.indexbox.io
2026-05-28
IndexBox
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