Semiconductor News & Analysis Feed

Taiwan Semiconductor Manufacturing Company (TSMC) has partnered with Winbond to accelerate the local DRAM supply chain using 3D wafer-on-wafer (WoW) stacking technology. This initiative supports Taiwan's efforts to enhance domestic semiconductor self-reliance while meeting the growing demand for hig

The growing demand for high-performance chips in AI applications is driving significant expansion in the semiconductor silicon capacitor (Si-Cap) market. Winbond, a leading player in this field, is raising product prices to meet increasing demand, with Si-Cap shipments expected to surge in 2027. Sup