Semiconductor News & Analysis Feed
624 articles
2026-05-27
www.digitimes.com
2026-05-27
digitimes
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
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2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English
NEWS PROVIDED BY
USI
27 May, 2026, 07:00 CST
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
marklapedus.substack.com
2026-05-27
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Europe Launches New Chip/Packaging R&D Projects
These projects include GaN/SiC packaging, quasi-monolithic integration, 3D qub
2026-05-27
us.acrofan.com
2026-05-27
acrofan.com
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.01net.it
2026-05-27
01net
www.01net.it
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2026-05-26
markets.financialcontent.com
2026-05-26
FinancialContent
Vadzo Imaging Launches Bolt-544CRS: 5MP Color Wake-On-Motion MIPI Camera Featuring Onsemi AR0544 HyperLux Sensor
By:
ACCESS Newswire
May 26, 2026 at 11:30 AM EDT
ⓘ This article is third-party content and does not represent the views of this site. We make no guarantees regarding its accuracy or completeness.
"The Bolt‑544CRS is a 5MP rolling shutter MIPI camera developed around the Onsemi Hyperlux
2026-05-26
www.joplinglobe.com
2026-05-26
The Joplin Globe
TOKYO & NORTH KINGSTOWN, R.I.--(BUSINESS WIRE)--May 26, 2026--
FUJIFILM Corporation announced today that it will present new semiconductor packaging research findings and exhibit its ZEMATES 1 product line of photosensitive insulating materials, including PFAS-free 2 PBO, at the Electronic Components and Technology Conference 2026 (ECTC 2026), May 26–29, 2026, in Orlando, Florida.
As part of the
2026-05-26
sg.finance.yahoo.com
2026-05-26
Yahoo Finance Singapore
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2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
www.tradingkey.com
2026-05-26
TradingKey
Optical communication stocks surged on May 26 due to advancements in GPU-HBM integration using fiber optic interconnects. This innovative solution overcomes physical limitations of traditional 2.5D packaging by decoupling compute and memory units, allowing greater HBM capacity and improved thermal management. If successful, it will expand optical interconnects beyond data centers and benefit silic
2026-05-26
www.mk.co.kr
2026-05-26
매일경제
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2026-05-26
www.linkedin.com
2026-05-26
LinkedIn
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2026-05-26
letsdatascience.com
2026-05-26
Let's Data Science
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2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging technology than a strategic reshuffling of supply aimed at safeguarding critical American industries.
2026-05-26
digitimes.com
2026-05-26
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.
2026-05-26
digitimes.com
2026-05-26
Huawei has released itsData Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to 10 years, as AI large language models drive data creation into what the company calls the yottabyte era.
2026-05-26
digitimes.com
2026-05-26
Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account for more than half of revenue. Despite continued uncertainty in the global environment, Peng remains cautiously optimistic about the second half of 2026 and expects the company to maintain relatively strong performa
2026-05-26
www.tweaktown.com
2026-05-26
TweakTown
AMD's Zen 7 'Grimlock' CPUs will reportedly utilize TSMC's 1.4nm 'A14' node and advanced packaging
The company is also looking to integrate Powertech's FOPLP advanced packaging technology into the Zen 7 architecture, along with next-gen 3D V-Cache.
VIEW GALLERY - 3
Hassam Nasir
Tech Reporter
Published May 25, 2026 2:50 PM CDT
2 minutes & 30 seconds read time
TL;DR: AMD is preparing its Zen 7 "Grim