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Introducing STM32C5 in India, STMicroelectronics explained how the new series targets cost-sensitive applications with improved performance, memory, and connectivity.

Microcontroller STM32C5 STMicroelectronics ARM Cortex-M33 Ethernet integration Cost-sensitive design Industrial IoT Smart devices

How Long Will CAN Stick Around As Rival Networks Speed Up?

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semiengineering.com 2026-04-29 Liz Allan

New in-vehicle networking technology will likely take over as more AI is added, but in ...

Automotive Ethernet CAN Bus LIN Bus Software-Defined Vehicles Time-Sensitive Networking Ethernet Bridge In-Vehicle Networks Autonomous Driving

What the DRAM Crunch Teaches Us About System Design

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eetimes.com 2026-04-28 Avi Baum

Redesign your AI systems for efficiency—escape the DRAM crunch by embracing smaller, smarter models.

DRAM shortage AI system design memory constraints high-bandwidth memory edge computing AI infrastructure system architecture supply chain risk

Why Data Centers Must Become System‑Aware

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eetimes.com 2026-04-27 Aoife Foley

Future data centers must become system-aware to survive AI, 5G, and the global energy crunch.

Data Centers Artificial Intelligence 5G Networks Energy Efficiency System Optimization Edge Computing Compute Distribution Network Latency

What Hormuz Exposed About Our Semiconductor Supply Chain

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eetimes.com 2026-04-24 Kevin Berghoff

The semiconductor industry is facing a reckoning it has postponed for years.

Semiconductor Supply Chain Supply Chain Disruption Helium Shortage Geopolitical Risk Chip Manufacturing Logistics Shock AI Chip Demand Critical Material Dependency

Telecom Industry Bets on Automation to Tackle AI Squeeze

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eetimes.com 2026-04-23 Pablo Valerio

The telecom sector's survival hinges on rapid software automation to counteract soaring hardware costs fueled by the booming AI demand.

Telecom Industry Artificial Intelligence Semiconductor Supply Chain Automation Capital Expenditure 5G 6G Chip Costs

Can Edge AI Keep Up?

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semiengineering.com 2026-04-23 Ann Mutschler

As models evolve faster than silicon cycles, experts weigh how much adaptability archit...

Edge AI AI chips Heterogeneous architecture Model updates Computing power Hardware adaptation Software toolchain AI processors

TSMC Chases Soaring AI Demand

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eetimes.com 2026-04-17 Alan Patterson

TSMC slams the gas to expand chip production for AI giants, but shortages loom.

TSMC AI chips Semiconductor manufacturing Chip capacity 3nm process 2nm process AI infrastructure Chip foundry

EU DARE Project Is Scrambling to Replace Codasip

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eetimes.com 2026-04-17 Pablo Valerio

EU DARE project explores alternatives after Codasip divestment creates uncertainty around roadmap and architectural direction.

EU Semiconductor Project DARE Initiative RISC-V Architecture European Supercomputing Semiconductor Supply Chain Secure Chips EDA Tools European Tech Sovereignty

Chiplet Standards Aim For Plug-n-Play

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semiengineering.com 2026-04-16 Bryon Moyer

They're necessary, but insufficient for a marketplace.

Chiplet Standardization Plug-and-Play Semiconductor Industry System Architecture Interoperability Chip Packaging Chiplet Marketplace

Intel Enters Pact With Tesla and SpaceX for Terafab

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eetimes.com 2026-04-09 Pablo Valerio

“Terafab is likely an Intel fab expansion, with Tesla, SpaceX, and xAI as anchor customers, rather than a standalone venture,” said Yole analyst Adrien Sánchez.

Semiconductor Manufacturing Chip Design AI Chips Terafab Project Intel Partnership Tesla SpaceX AI Infrastructure

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