Semiconductor News & Analysis Feed

9 articles
2026-07-03
www.securitysystemsnews.com 2026-07-03 Security Systems News
2026-07-02
tomshardware.com 2026-07-02 Anton Shilov
SpaceX is reportedly working on a handheld device that runs a proprietary operating system and features advanced AI capabilities from xAI, but Elon Musk denies existence of the product.
2026-06-26
www.newelectronics.co.uk 2026-06-26 New Electronics
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2026-06-24
www.moomoo.com 2026-06-24 Moomoo
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2026-06-23
digitimes.com 2026-06-23
Google released a 30,000-word AI roadmap on June 14 that, for the first time, clearly defines AI having the capability of 100 million humans as a key milestone on the path to artificial superintelligence (ASI). The plan outlines a three-stage evolution from today's large models to artificial general intelligence (AGI) and then ASI, reinforcing expectations that AI capabilities will keep expanding
2026-06-22
cryptobriefing.com 2026-06-22 Crypto Briefing
Baidu pushes for full-stack AI capabilities as Nvidia chip access expands China's search giant is building its own chips, models, and cloud infrastructure while simultaneously gaining access to restri
2026-06-17
www.nknews.org 2026-06-17 NK News
<img decoding="async" class="img-fluid alignnone wp-image-866954 size-large" src="https://assets.korearisk.com/uploads/2026/05/west_coast_exchange_mobile.gif" alt="West Coast Exchange, North Korea Watcher Conference, Sept. 2026" data-content-piece="Apply to attend West Coast Exchange Today" /> North Korea relies on older Nvidia graphics cards and Qualcomm chips to apply artificial intelligence (A
2026-06-16
digitimes.com 2026-06-16
Apple is stepping up the AI capabilities of its Siri voice assistant, and analysts say memory chip demand will rise along with it, potentially benefiting Apple's suppliers such as Samsung Electronics and SK Hynix. The shift could drive both shipment growth and higher prices for mobile DRAM.
digitimes.com
Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status se