80 articles
2026-05-12
www.tradingview.com
2026-05-12
TradingView
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2026-05-12
www.gurufocus.com
2026-05-12
GuruFocus
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2026-05-11
www.investing.com
2026-05-11
Investing.com
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2026-05-10
www.msn.com
2026-05-10
MSN
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2026-05-10
www.investing.com
2026-05-10
Investing.com
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2026-05-10
digitimes.com
2026-05-10
Vanguard International Semiconductor said AI-driven demand has largely offset geopolitical and macroeconomic headwinds and will be the dominant force shaping semiconductor industry conditions in 2026. The wafer foundry said AI infrastructure buildout has crowded available capacity, pushed prices higher and accelerated customer orders for its Singapore 12-inch fab, with sampling now slated for July
2026-05-09
www.digitimes.com
2026-05-09
digitimes
Since the second half of 2025, the global semiconductor industry has been squeezed by a rare convergence of forces: surging artificial intelligence (AI) demand, escalating geopolitical fragmentation, and...The article requires paid subscription.Subscribe Now
2026-05-08
news.futunn.com
2026-05-08
富途牛牛
访问频繁，请稍后重试您所要访问的页面不在这儿，它可能正忙着刷牛牛圈，稍后就能恢复正常返回主页
2026-05-07
stockstory.org
2026-05-07
StockStory
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2026-05-07
finance.yahoo.com
2026-05-07
Yahoo Finance
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2026-05-06
digitimes.com
2026-05-06
On May 5, AMD reported first-quarter 2026 results that exceeded expectations, supported by strong demand for artificial intelligence (AI) infrastructure, according to company data and media reports. Revenue reached US$10.25 billion, while net profit rose to US$1.38 billion, reflecting robust year-on-year growth across key metrics.
2026-05-06
digitimes.com
2026-05-06
Lumentum reported record third-quarter fiscal 2026 results, with revenue rising to US$808 million, reflecting strong year-over-year growth driven by demand for optical components used in AI infrastructure, according to the company.
2026-05-06
www.newelectronics.co.uk
2026-05-06
New Electronics
As demand for high-performance AI chips rises, competition for 3nm and below fabrication capacity, along with advanced packaging technologies such as 2.5D and 3D integration, is becoming increasingly intense.One of the most persistent bottlenecks has been in advanced packaging, especially chip-on-wafer-on-substrate (CoWoS) technology. Shortages have extended beyond fabrication itself, affecting up
2026-05-05
www.msn.com
2026-05-05
MSN
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2026-05-05
www.msn.com
2026-05-05
MSN
2026-05-05
www.barrons.com
2026-05-05
Barron's
2026-05-05
digitimes.com
2026-05-05
The development of next-generation server memory DDR6 is reportedly entering early hardware validation, as memory makers and supply chain partners begin pre-development work ahead of formal standardization. The industry is coordinating closely across chip designers, substrate manufacturers, and controller IP providers to prepare for the transition from DDR5, which is now entering maturity in data
2026-05-04
www.digitimes.com
2026-05-04
digitimes
2026-04-23
eetimes.com
2026-04-23
Pablo Valerio
The telecom sector's survival hinges on rapid software automation to counteract soaring hardware costs fueled by the booming AI demand.
2026-04-17
eetimes.com
2026-04-17
Alan Patterson
TSMC slams the gas to expand chip production for AI giants, but shortages loom.