Semiconductor News & Analysis Feed
6 articles
2026-07-06
digitimes.com
2026-07-06
Zhonghao Xinying (Hangzhou) Technology has launched its new self-developed high-performance TPU AI processor, Xuyu, alongside Taize 2.0, a software-hardware integrated AI computing platform built around the chip.
2026-06-16
www.tomshardware.com
2026-06-16
Tom's Hardware
Tech Industry Manufacturing Semiconductors
TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package
News
By Anton Shilov published 16 hours ago
CoPoS may enable larger chips, but CoWoS is still better.
(Image credit: Intel)
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2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
CoPoS may enable larger chips, but CoWoS is still better.
2026-06-09
digitimes.com
2026-06-09
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup manufacturing and packaging partner for next-generation AI processors.
2026-05-20
tspasemiconductor.substack.com
2026-05-20
semivision
__fail__
2026-05-19
eetimes.com
2026-05-19
Majeed Ahmad
Empower Semiconductor’s integrated voltage regulators (IVRs) can be placed directly inside an AI processor package.