Semiconductor News & Analysis Feed
105 articles
2026-06-08
digitimes.com
2026-06-08
Lead frame manufacturer Chang Wah Technology Co. (CWTC) says that as applications such as data centers, AI servers, and industrial control systems continue to grow rapidly, market demand for power management components is steadily increasing, driving growth in lead frame shipments. Demand for microcontrollers (MCUs) used in PCs, networking equipment, industrial control systems, and electric vehicl
2026-06-08
digitimes.com
2026-06-08
Nvidia's upcoming Vera Rubin AI server platform has become the focus of intense scrutiny after a late-stage redesign of its thermal architecture.
2026-06-07
digitimes.com
2026-06-07
Strong demand for memory procurement from AI servers continues, and ADATA chairman Simon Chen believes the AI expansion cycle is expected to sustain strong growth for at least another four to five years. As a result, ADATA is adding AI data center construction as a new business focus, working with strategic partners to deploy projects in four countries, including Brazil and Malaysia. The company e
2026-06-05
tomshardware.com
2026-06-05
Jowi Morales
These "makeshift" structures are housing hardware that costs millions of dollars in total.
2026-06-04
www.semiconductor-today.com
2026-06-04
Semiconductor Today
ROHM’s 750V SiC MOSFET adopted in battery backup unit for AI servers
ROHM says that its 750V silicon carbide (SiC) MOSFET has been adopted in a BBU (battery backup unit) for AI server power supplies. With the rise of generative AI, AI server power systems are shifting to higher voltages and rapidly transitioning to HVDC (high-voltage direct current) architectures. In this environment, ROHM’s devi
2026-06-04
news.google.com
2026-06-04
GlobeNewswire
2026-06-03
www.stocktitan.net
2026-06-03
Stock Titan
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2026-06-03
www.presseagentur.com
2026-06-03
presseagentur.com
ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance
Willich-Münchheide, Germany, June 03, 2026 – ROHM has announced that its 750 V SiC MOSFET has been adopted in a BBU (Battery Backup Unit) for AI server power supplies. With the rise of generative AI, AI server power systems are shifting to higher voltages and rapidly transitioning to HVDC (high-voltage direct current) a
2026-06-03
www.bisinfotech.com
2026-06-03
Bisinfotech
Home/ Semiconductor Component/ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance
ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance
Vaishali Chauhan June 3, 2026
2 minutes read
ROHM Co., Ltd. has announced that its 750 V SiC MOSFET has been adopted in a BBU (Battery Backup Unit) for AI server power supplies. With the rise of generative AI,
2026-06-02
finance.yahoo.com
2026-06-02
Yahoo Finance
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2026-06-02
www.eletimes.ai
2026-06-02
ELE Times
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2026-06-01
electronics360.globalspec.com
2026-06-01
Electronics360
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2026-05-31
www.ad-hoc-news.de
2026-05-31
AD HOC NEWS
Infineon, DE0006231004
Infineon Technologies stock (DE0006231004): NVIDIA AI server partnership and chart picture in focus
31.05.2026 - 14:58:41 | ad-hoc-news.de
Infineon Technologies shares on Xetra reacted to fresh news about a partnership in NVIDIA’s MGX AI server ecosystem, while investors also assess where the stock stands within its current 52-week trading range and key technical markers.
2026-05-29
www.reuters.com
2026-05-29
Reuters
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2026-05-29
ca.finance.yahoo.com
2026-05-29
Yahoo! Finance Canada
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2026-05-29
timestech.in
2026-05-29
TimesTech
BuzzIndustry NewsIndustriesPower Management
Infineon Technologies Joins NVIDIA MGX AI Ecosystem for AI Server Power Innovation
By TimesTech -
May 29, 2026
0
5
Infineon Technologies, a leading provider of power systems and IoT, has joined NVIDIA’s MGX AI Factory ecosystem to help transform power delivery for next-generation AI data centers. Infineon’s power management solutions will support NVIDIA
2026-05-29
www.geneonline.com
2026-05-29
geneonline.com
Infineon Technologies AG has joined NVIDIA’s MGX AI factory ecosystem to develop advanced power delivery architectures for next-generation AI server racks. The collaboration focuses on creating solutions that meet the increasing power demands of AI workloads, enhancing system efficiency, and reducing overall energy consumption in data centers.
Infineon’s contributions will include developing high
2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
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2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
digitimes.com
2026-05-29
Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa, as the electronics manufacturer looks beyond AI servers for its next phase of growth.