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A watershed moment occurred on the battlefields of Ukraine in 2024 when 10 fully autonomous AI-controlled quadcopter drones were sent to the front lines against Russia with ‘Terminator Mode’ engaged.

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ELAN Microelectronics is broadening beyond notebook PCs into agentic AI PCs, unmanned vehicles, and optical communication chips, moves that could influence technology supply chains across Asia, the US, and Europe. The company also disclosed a strategic investment in US-based PETA Optronics, signaling a deeper push into next-generation hardware markets worldwide.

Taiwanese fabless chipmaker ELAN said its second-quarter 2026 outlook suggests revenue will hold near first-quarter levels, even as the company expands beyond PC orders into drones, AI PCs, and optical modules. The company also said drone-related revenue could grow multiple times over the next two years.

A conceptual diagram of ITM Semiconductor's motor controller SiP. (Graphic: ITM Semiconductor) ITM Semiconductor said on June 8 that it will develop next-generation motor control technology for robots and drones after being selected as the lead company for South Korea's Ministry of Trade, Industry and Energy-backed "Next-Generation System-in-Package (SiP) Core Technology Development" program. Un

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DJI has published the results of an independent security assessment by U.S. cybersecurity firm OnDefend.

It also features a software stack that could potentially allow it to operate as a singular unit with drones operating in the air, on the land, and on the surface.

Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNewsreported, citing industry sources.

Users can easily spray on this radar absorbent material on any drone to increase their survivability in contested skies.

Swancor Holding and RobiChip Technology announced a strategic partnership to accelerate the adoption of advanced packaging materials and heterogeneous chip system integration in robots, robot dogs, and AI-powered platforms, the firms said at the forum on...The article requires paid subscription.Subscribe Now