Semiconductor News & Analysis Feed
2625 articles
2026-06-16
www.digitimes.com
2026-06-16
digitimes
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC...
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2026-06-16
www.benzinga.com
2026-06-16
Benzinga
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2026-06-16
www.cnbc.com
2026-06-16
CNBC
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2026-06-16
www.digitimes.com
2026-06-16
digitimes
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS...
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2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
Qualcomm’s Reported Tenstorrent Talks Test Lofty Valuation And AI Ambitions
Simply Wall St
Mon, June 15, 2026 at 8:20 PM PDT 2 min read
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Qualcomm, ticker NasdaqGS:QCOM, is reportedly in talks to acquire AI chip startup Tenstorrent
2026-06-16
www.msn.com
2026-06-16
MSN
Elon Musk’s SpaceX went public on Friday, exploding onto the scene with a valuation that quickly eclipsed $2 trillion.
Things went swimmingly for a while, with shares steadily rising from a debut $150 — a premium of 11 percent over the original asking price — on Friday to well over $200 on Tuesday. But after peaking at $222 Tuesday morning, SpaceX started its first sustained decline of its nascen
2026-06-16
tomshardware.com
2026-06-16
Zhiye Liu
Our RAM benchmark hierarchy ranks DDR5 and DDR4 memory kits of all frequencies and capacities for any budget.
2026-06-16
www.msn.com
2026-06-16
MSN
Record price target: TD Cowen lifted Micron's target to $1,500, projecting strong AI-fueled growth and sustained pricing power.
Supply sold out: Micron's 2026 high-bandwidth memory output is fully booked, with 2027 orders already under negotiation.
Earnings in focus: Investors await June 24 results for signs of long-term contracts and profit margin strength.
Record-breaking rally: Micron stock
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
TSMC, TW0002330008
Capacity push for AI: TSMC’s CoWoS packaging ramps toward 140,000 wafers a month
16.06.2026 - 02:00:19 | ad-hoc-news.de
TSMC’s CoWoS advanced packaging line is emerging as a quiet workhorse of the AI boom. Industry data now points to capacity as high as 120,000 to 140,000 wafers per month by 2026, as the Taiwanese foundry pours billions into a technology that has become critica
2026-06-16
digitimes.com
2026-06-16
Samsung Electronics' foundry business is reportedly expanding its strategic relationship with companies led by Elon Musk, with cooperation now spanning electric vehicles and emerging neurotechnology, according to Hankyungreporting.
2026-06-16
digitimes.com
2026-06-16
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.
2026-06-16
digitimes.com
2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
digitimes.com
2026-06-16
Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing toward pilot production and mass manufacturing.
2026-06-16
digitimes.com
2026-06-16
AMD said it will acquire MEXT, a move aimed at strengthening its AI and data center portfolio amid rising global memory demand. The deal is intended to help customers improve performance, reduce infrastructure costs, and accelerate the deployment of AI, analytics, and high-performance workloads across cloud and enterprise systems.
2026-06-16
digitimes.com
2026-06-16
China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) — an essential material for building silicon-based quantum computers. The breakthrough builds on a government push to sharpen its quantum research edge and reduce its reliance on foreign technology supply chains more broadly.
2026-06-16
eetimes.com
2026-06-16
Pablo Valerio
Researchers at the University of São Paulo use RISC-V to build the Internet of Trees, a real-time monitoring network for the Amazon rainforest.
2026-06-16
digitimes.com
2026-06-16
Apple is stepping up the AI capabilities of its Siri voice assistant, and analysts say memory chip demand will rise along with it, potentially benefiting Apple's suppliers such as Samsung Electronics and SK Hynix. The shift could drive both shipment growth and higher prices for mobile DRAM.
2026-06-16
digitimes.com
2026-06-16
Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial daily Sedaily, moving ahead just four months after presenting what it described as the world's first 8nm-class MRAM at an international conference.
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
digitimes.com
2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th