Semiconductor News & Analysis Feed
202 articles
2026-06-16
tomshardware.com
2026-06-16
Zhiye Liu
Our RAM benchmark hierarchy ranks DDR5 and DDR4 memory kits of all frequencies and capacities for any budget.
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
digitimes.com
2026-06-16
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as part of a broader push to capitalize on AI demand. The company said the investments will be fully supported and financed by long-term customer commitments, and it expects to represent at least five leading US tech partners.
2026-06-16
digitimes.com
2026-06-16
China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity for the second half of the year. But supply chain players say the long-term priority is still to expand substrate capacity from non-China sources, with supply security for the AI industry outweighing price.
2026-06-16
ca.investing.com
2026-06-16
Investing.com Canada
ca.investing.com
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2026-06-16
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2026-06-16
Investing.com
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2026-06-16
letsdatascience.com
2026-06-16
Let's Data Science
FUNDING & BUSINESS
micron
hbm
market analysis
semiconductors
Micron's Sold-Out HBM Capacity Creates June 24 Catalyst
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June 15, 2026
5.5
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Photo: i-invdn-com.investing.com · rights & takedowns
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A Market Analysis highlights that Micron Technology Inc has sold out its HBM capacity and identifies June 24 as a make-or-break catalyst. The analysis also covers
2026-06-16
www.tradingview.com
2026-06-16
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GuruFocus
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Google's Samsung Talks Highlight TSMC Capacity Crunch
Google's Samsung Talks Highlight TSMC Capacity Crunch
Less than 1 min read
GOOG
+2.61%
Alphabet (GOOG, Financials) may be looking beyond Taiwan Semiconductor Manufacturing for part of its future AI chip production, and that says a lot about how tight the market has become.
Google is reportedly in talks with Samsung to make
2026-06-16
www.gurufocus.com
2026-06-16
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2026-06-15
www.gurufocus.com
2026-06-15
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2026-06-15
www.engineering.com
2026-06-15
Engineering.com
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2026-06-15
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2026-06-15
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2026-06-15
news.futunn.com
2026-06-15
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2026-06-15
datacentremagazine.com
2026-06-15
Data Centre Magazine
NVIDIA is strengthening its position in the AI infrastructure market through a series of agreements in South Korea that span memory supply, data centre development and AI-powered industrial systems.
During a four-day visit to Seoul, NVIDIA's CEO, Jensen Huang, secured agreements with SK hynix, SK Telecom, Naver, Doosan Group, LG Group and Hyundai Motor Group.
The financial terms to the partnersh
2026-06-15
evertiq.com
2026-06-15
Evertiq
© Liviorki for Evertiq
Business | June 15, 2026
CADFEM APAC, SilTerra partner to advance semiconductor innovation
Evertiq
The partnership brings together CADFEM APAC’s expertise in multiphysics simulation, digital engineering and predictive development frameworks with SilTerra’s knowledge of semiconductor manufacturing, process development and fabrication technologies.
CADFEM APAC, a Hyderabad-ba
2026-06-15
www.indexbox.io
2026-06-15
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2026-06-15
digitimes.com
2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization
2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-15
digitimes.com
2026-06-15
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical communications market. Taiwanese compound semiconductor suppliers including Visual Photonics Epitaxy (VPEC) and Global Communication Semiconductors (GCS)