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2026-05-03
Intel’s ZAM Memory Threatens HBM’s AI Throne With 2x The Bandwidth of HBM4, More Capacity & Low Thermal Constraints - Wccftech
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wccftech.com 2026-05-03 Wccftech
2026-05-03
User Clip: House Debate, CHIPS Act - C-SPAN
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www.c-span.org 2026-05-03 C-SPAN
2026-05-03
AI Servers Create New MLCC Trend: Will It Be the Next HBM? - TradingKey
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www.tradingkey.com 2026-05-03 TradingKey
2026-05-03
QNAP Unveils QAI-h1290FX Edge AI NAS with Blackwell GPU - Let's Data Science
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letsdatascience.com 2026-05-03 Let's Data Science
2026-04-30
Timestamp Drift and Sensor Synchronization: Small Timing Errors, Big Safety Consequences
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eetimes.com 2026-04-30 Nitish Sanghi
Minor timing errors can make an autonomous system act on a world model that is already out of date.
Autonomous SystemsTiming SynchronizationSensor FusionSystem IntegrationSafety MechanismsTiming ErrorsLocalization AccuracyMotion Compensation
2026-04-30
Creating Agentic EDA Methodologies
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semiengineering.com 2026-04-30 Brian Bailey
Current approaches involve multiple tools, vendors, designs, data formats, and abstract...
EDA IndustryArtificial IntelligenceSemiconductor DesignAgentic FlowData AbstractionAI ToolsDesign AutomationChip Architecture
2026-04-30
NoC Coherency Challenges Balloon With AI SoCs And Chiplets
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semiengineering.com 2026-04-30 Liz Allan
Complex chips need coherent and non-coherent sub-NoCs to ensure efficient data paths. C...
Network-on-ChipAI SoCChipletsCache CoherencyData MovementSystem IntegrationMulti-die DesignNoC Architecture
2026-04-29
AI in Design Verification: Where It Works and Where It Doesn’t
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eetimes.com 2026-04-29 Mike Bartley
AI streamlines verification by targeting repetitive tasks but can't replace expert signoff.
AIDesign VerificationSemiconductorICAI-assisted VerificationCoverage AnalysisRegression TestingDebug Efficiency
2026-04-29
STMicro Introduces STM32C5 for Cost-Sensitive Smart Devices
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eetimes.com 2026-04-29 Yashasvini Razdan
Introducing STM32C5 in India, STMicroelectronics explained how the new series targets cost-sensitive applications with improved performance, memory, and connectivity.
MicrocontrollerSTM32C5STMicroelectronicsARM Cortex-M33Ethernet integrationCost-sensitive designIndustrial IoTSmart devices
2026-04-28
What the DRAM Crunch Teaches Us About System Design
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eetimes.com 2026-04-28 Avi Baum
Redesign your AI systems for efficiency—escape the DRAM crunch by embracing smaller, smarter models.
DRAM shortageAI system designmemory constraintshigh-bandwidth memoryedge computingAI infrastructuresystem architecturesupply chain risk
2026-04-27
SUSE Launches Industrial Edge Platform Following Losant Acquisition
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eetimes.com 2026-04-27 Yashasvini Razdan
Keith Basil, edge strategy and product leader at SUSE, outlines how the Losant acquisition shapes SUSE Industrial Edge and its deployment model.
Industrial IoTEdge ComputingCloud-NativeSUSELosantIndustrial Edge PlatformOPC UAMQTT
2026-04-27
Why Data Centers Must Become System‑Aware
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eetimes.com 2026-04-27 Aoife Foley
Future data centers must become system-aware to survive AI, 5G, and the global energy crunch.
Data CentersArtificial Intelligence5G NetworksEnergy EfficiencySystem OptimizationEdge ComputingCompute DistributionNetwork Latency
2026-04-27
When Semiconductor Materials Misbehave
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semiengineering.com 2026-04-27 Gregory Haley
The gap between lab performance and fab reality is growing wider as packages grow more ...
Semiconductor materialsAdvanced packagingMaterial behaviorSimulation modelsManufacturing complexityHeterogeneous integrationThermal historyMechanical stress
2026-04-24
What Hormuz Exposed About Our Semiconductor Supply Chain
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eetimes.com 2026-04-24 Kevin Berghoff
The semiconductor industry is facing a reckoning it has postponed for years.
Semiconductor Supply ChainSupply Chain DisruptionHelium ShortageGeopolitical RiskChip ManufacturingLogistics ShockAI Chip DemandCritical Material Dependency
2026-04-23
Telecom Industry Bets on Automation to Tackle AI Squeeze
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eetimes.com 2026-04-23 Pablo Valerio
The telecom sector's survival hinges on rapid software automation to counteract soaring hardware costs fueled by the booming AI demand.
Telecom IndustryArtificial IntelligenceSemiconductor Supply ChainAutomationCapital Expenditure5G6GChip Costs
2026-04-20
YMTC’s NAND Design Surprise Alongside a New Fab
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eetimes.com 2026-04-20 Majeed Ahmad
China’s memory underdog defies sanctions by building a fab that mostly sources equipment, materials, and tools locally.
YMTCNAND FlashSemiconductor ManufacturingChinese ChipsMemory Chips3D NANDDRAMFab Construction
2026-04-17
EU DARE Project Is Scrambling to Replace Codasip
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eetimes.com 2026-04-17 Pablo Valerio
EU DARE project explores alternatives after Codasip divestment creates uncertainty around roadmap and architectural direction.
EU Semiconductor ProjectDARE InitiativeRISC-V ArchitectureEuropean SupercomputingSemiconductor Supply ChainSecure ChipsEDA ToolsEuropean Tech Sovereignty
2026-04-14
BSC Spinoff to Secure Chips for Critical Infrastructure
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eetimes.com 2026-04-14 Pablo Valerio
BSC and UPC launch a spin-off creating auditable processor architecture for European critical infrastructure.
Semiconductor Supply ChainEuropean Technological SovereigntyCritical Infrastructure SecurityChip DesignRISC-V ArchitectureSecure ChipsSupercomputing CenterEU Technology Policy
2026-04-13
Three Misconceptions About the $402B Semiconductor Foundry Industry
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eetimes.com 2026-04-13 Pierre Cambou
Unpack the $402B semiconductor foundry industry myths—discover who really dominates and why global alliances drive the chips in your life.
Semiconductor FoundryTSMCAdvanced NodeAI CapexGlobal Supply ChainIDMOpen FoundryChinese Semiconductors
2026-04-09
Intel Enters Pact With Tesla and SpaceX for Terafab
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eetimes.com 2026-04-09 Pablo Valerio
“Terafab is likely an Intel fab expansion, with Tesla, SpaceX, and xAI as anchor customers, rather than a standalone venture,” said Yole analyst Adrien Sánchez.
Semiconductor ManufacturingChip DesignAI ChipsTerafab ProjectIntel PartnershipTeslaSpaceXAI Infrastructure