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2026-06-16
Engineering education for the semiconductor economy - University of Idaho
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www.uidaho.edu 2026-06-16 University of Idaho
2026-06-16
TSMC Partners With Ibiden and Innolux to Advance Glass Substrate Packaging Technology; CoPoS Advanced Packaging Validation Data Revealed for the First Time - TradingKey
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www.tradingkey.com 2026-06-16 TradingKey
2026-06-16
Qualcomm’s Reported Tenstorrent Talks Test Lofty Valuation And AI Ambitions - Yahoo Finance
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finance.yahoo.com 2026-06-16 Yahoo Finance
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - Morningstar
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www.morningstar.com 2026-06-16 Morningstar
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - bastillepost.com
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www.bastillepost.com 2026-06-16 bastillepost.com
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - Caledonian Record
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www.caledonianrecord.com 2026-06-16 Caledonian Record
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - The Joplin Globe
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www.joplinglobe.com 2026-06-16 The Joplin Globe
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - Bluefield Daily Telegraph
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www.bdtonline.com 2026-06-16 Bluefield Daily Telegraph
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - mykxlg.com
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www.mykxlg.com 2026-06-16 mykxlg.com
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - Business Wire
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news.google.com 2026-06-16 Business Wire
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - Yahoo Finance Singapore
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sg.finance.yahoo.com 2026-06-16 Yahoo Finance Singapore
2026-06-16
From CoWoS to CoPoS, Taiwan Semiconductor's glass substrate verification has broken through the packaging performance bottleneck. - Moomoo
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www.moomoo.com 2026-06-16 Moomoo
2026-06-16
Murata Manufacturing : Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - marketscreener.com
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www.marketscreener.com 2026-06-16 marketscreener.com
2026-06-16
SK Hynix reportedly readies HBM4E samples for Nvidia as Samsung pulls ahead
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digitimes.com 2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th
2026-06-16
Rapidus signs UK chip pact in push for 2nm customers
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digitimes.com 2026-06-16
Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025 to support Britain's semiconductor ecosystem, marking a step toward cooperation on future semiconductor manufacturing and potential customer development in the UK, according to Rapidus and reports from Nikkei, Bloomberg,and Reuters.
2026-06-16
TSMC PLP timeline faces skepticism from Taiwan industry sources
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digitimes.com 2026-06-16
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry sources, who say the timeline is likely premature and that the company remains focused on evaluating multiple advanced-packaging options.
2026-06-16
Supply security over cost: Google leads CSP charge to diversify InP substrate sourcing
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digitimes.com 2026-06-16
China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity for the second half of the year. But supply chain players say the long-term priority is still to expand substrate capacity from non-China sources, with supply security for the AI industry outweighing price.
2026-06-16
Nvidia reportedly tightens grip on AI inference market despite growing competition
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digitimes.com 2026-06-16
Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue.
2026-06-16
Apple leans on Google Cloud and Nvidia GPUs in a pragmatic AI reset
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digitimes.com 2026-06-16
After Apple's WWDC 2026 keynote, online rumors claimed that only premium devices with 12GB of memory could run on-device AI, but DIGITIMES analyst Luke Lin said on a podcast that that was just Apple's messaging. Most on-device AI features only need 8GB of memory; only the Apple-defined advanced on-device AI requires the higher 12GB spec.
2026-06-16
AIXTRON (XTRA:AIXA) Stock Valuation After ROHM GaN Partnership And Strong AI Power Demand - simplywall.st
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simplywall.st 2026-06-16 simplywall.st