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2026-06-12
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2026-06-12
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2026-06-12
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2026-06-12
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2026-06-10
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2026-06-10
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2026-06-10
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2026-06-10
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2026-06-10
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2026-06-10
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2026-06-10
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-08
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2026-06-08
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2026-06-08
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2026-06-08
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2026-06-08
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2026-06-08
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2026-06-08
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2026-06-08
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Home/ Semiconductor Component/ Automotive Electronics/Infineon Expands 750V CoolSiC Portfolio with H-DPAK Devices
Infineon Expands 750V CoolSiC Portfolio with H-DPAK Devices
Vaishali Chauhan June 8, 2026
2 minutes read
Power conversion architectures in automotive and industrial applications are evolving rapidly, placing new demands on switching topologies, thermal management, and system integ
2026-06-06
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2026-06-06
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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Home/ Semiconductor Component/Infineon Launches EiceDRIVER Gate Driver for AI Datacenters
Infineon Launches EiceDRIVER Gate Driver for AI Datacenters
Vaishali Chauhan June 4, 2026
2 minutes read
Infineon Technologies AG introduces the EiceDRIVER 2EDL90xG3, a 120 V common footprint gate driver designed to enable silicon (Si) and gallium nitride (GaN) power designs on the same PCB. As AI datace
2026-06-03
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2026-06-03
Bisinfotech
Home/ Semiconductor Component/ Power Electronics/ AC-DC / DC-DC / Converters/TDK presents DC-link capacitors with ultra-low inductance for SiC-based power electronics
TDK presents DC-link capacitors with ultra-low inductance for SiC-based power electronics
Vaishali Chauhan June 3, 2026
2 minutes read
TDK Corporation presents the B25696H series of MKP DC high-frequency (HF) film capacitors, a
2026-06-03
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2026-06-03
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2026-06-03
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2026-06-03
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Home/ Data Center/Infineon Expands SiC Solutions for AI Data Centers
Infineon Expands SiC Solutions for AI Data Centers
Vaishali Chauhan June 3, 2026
2 minutes read
Infineon Technologies AG is expanding its CoolSiC JFET portfolio in response to growing demand from AI data centers and the shift towards solid-state power protection. With new devices, package options and configurations, the comp
2026-06-03
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2026-06-03
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Home/ Semiconductor Component/ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance
ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance
Vaishali Chauhan June 3, 2026
2 minutes read
ROHM Co., Ltd. has announced that its 750 V SiC MOSFET has been adopted in a BBU (Battery Backup Unit) for AI server power supplies. With the rise of generative AI,