Semiconductor News & Analysis Feed
5393 articles
2026-06-16
www.digitimes.com
2026-06-16
digitimes
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor...
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2026-06-16
www.bisinfotech.com
2026-06-16
Bisinfotech
www.bisinfotech.com
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2026-06-16
briefglance.com
2026-06-16
BriefGlance
STMicroelectronics’ Deft $1.5B Maneuver in a Surging Chip Market
📊 KEY DATA
$1.5 billion convertible bond offering by STMicroelectronics
5.5% dip in share price following the announcement
200% stock surge this year, reflecting strong market position
🎯 EXPERT CONSENSUS
Experts would likely conclude that STMicroelectronics' $1.5 billion bond offering is a strategic move to fortify its financial fou
2026-06-16
www.tweaktown.com
2026-06-16
TweakTown
US AI startup Tensordyne claims 3nm Napier chip outperforms NVIDIA Blackwell by 13x in tokens per second
The TDN72 rack houses 288 Napier chips, delivers 608 petaflops of FP8 compute, and claims to match the throughput of nine NVIDIA Rubin plus Groq LPX racks.
VIEW GALLERY - 3
Hassam Nasir
Tech Reporter
Published Jun 16, 2026 12:15 AM CDT
1 minute & 45 seconds read time
TL;DR: Tensordyne's 3nm N
2026-06-16
www.cnbc.com
2026-06-16
CNBC
Qualcomm
is working on over 40 designs of new AI devices, CEO Cristiano Amon told CNBC, as the chip designer prepares for a wave of “agents” across consumer electronics.
In a wide-ranging interview on CNBC’s “The Tech Download” podcast, Amon laid out his views on the changing role of smartphones and apps, why smart glasses could be the next major consumer device, new types of electronics that wi
2026-06-16
timestech.in
2026-06-16
TimesTech
BuzzIndustry News
Infineon Found to Infringe Innoscience Patents, Barred from Selling in China
By TimesTech -
June 16, 2026
0
52
Innoscience, announced that China’s Supreme People’s Court has upheld a sales injunction against certain gallium nitride (GaN) products manufactured by Infineon Technologies AG, bringing a patent infringement dispute between the two companies to a final conclusion in Ch
2026-06-16
evertiq.com
2026-06-16
Evertiq
© Air Liquide
Electronics Production | June 16, 2026
Air Liquide invests €200M in Korea to back SK hynix’s AI chip project
Evertiq
In order to supply SK hynix’s new packaging and testing fab “P&T7”, located in Cheongju, in the Chungcheongbuk province, Air Liquide will build and operate a state-of-the-art nitrogen production unit.
France’s Air Liquide has signed a long-term contract with SK hynix.
2026-06-16
www.msn.com
2026-06-16
MSN
Elon Musk’s SpaceX went public on Friday, exploding onto the scene with a valuation that quickly eclipsed $2 trillion.
Things went swimmingly for a while, with shares steadily rising from a debut $150 — a premium of 11 percent over the original asking price — on Friday to well over $200 on Tuesday. But after peaking at $222 Tuesday morning, SpaceX started its first sustained decline of its nascen
2026-06-16
autonews.gasgoo.com
2026-06-16
Gasgoo
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Li Auto launches new-gen cockpit platform powered by proprietary OS, Qualcomm's latest chip
Li Auto
Li Auto launches new-gen cockpit platform powered by proprietary OS, Qualcomm's latest chip
Monika From Gasgoo
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June 16 , 2026 10:34 BJT
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Gasgoo Munich- Li Auto used its Livis Day software and embodied intelligence event to introduce a new flagship cockpit
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
ASE Tech, TW0003711008
New high-density fan-out module, ASE Technology pushes advanced packaging for AI chips
16.06.2026 - 03:43:12 | ad-hoc-news.de
ASE Technology is highlighting its FOCoS fan-out module as a high-density packaging option for AI and data center processors, combining multiple dies and high-bandwidth memory in a single advanced substrate stack for hyperscale and HPC customers.
AS
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
PR Newswire
Mon, June 15, 2026 at 6:00 PM PDT 3 min read
New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that
2026-06-16
www.prnewswire.com
2026-06-16
PR Newswire
Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
NEWS PROVIDED BY
Rapidus Corporation
Jun 15, 2026, 21:00 ET
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New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the Fondazione
2026-06-16
www.msn.com
2026-06-16
MSN
Record price target: TD Cowen lifted Micron's target to $1,500, projecting strong AI-fueled growth and sustained pricing power.
Supply sold out: Micron's 2026 high-bandwidth memory output is fully booked, with 2027 orders already under negotiation.
Earnings in focus: Investors await June 24 results for signs of long-term contracts and profit margin strength.
Record-breaking rally: Micron stock
2026-06-16
digitimes.com
2026-06-16
Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025 to support Britain's semiconductor ecosystem, marking a step toward cooperation on future semiconductor manufacturing and potential customer development in the UK, according to Rapidus and reports from Nikkei, Bloomberg,and Reuters.
2026-06-16
digitimes.com
2026-06-16
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
digitimes.com
2026-06-16
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used in semiconductor manufacturing. Limited short-term supply additions and low industry inventories are widening the supply-demand gap, triggering a rapid price increase.
2026-06-16
digitimes.com
2026-06-16
Apple is stepping up the AI capabilities of its Siri voice assistant, and analysts say memory chip demand will rise along with it, potentially benefiting Apple's suppliers such as Samsung Electronics and SK Hynix. The shift could drive both shipment growth and higher prices for mobile DRAM.
2026-06-16
digitimes.com
2026-06-16
The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty gas used in chip manufacturing. Planned production adjustments or exits by some Japanese suppliers in the second half of 2026 have intensified concerns over tighter global supply, sending prices sharply higher and raising the risk of disruption into 2027.
2026-06-16
digitimes.com
2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.