Semiconductor News & Analysis Feed

Foxconn's semiconductor packaging subsidiary ShunSin Technology confirms a partnership with TSMC in COUPE (Co-Packaged Optics) technology, marking a significant advancement in Taiwan's semiconductor supply chain toward optical integration. This collaboration accelerates ShunSin's transition to CPO a

NVIDIA's latest Scale-Up CPO switch roadmap is reshaping next-generation AI infrastructure architecture. Co-packaged optics (CPO) technology is rapidly becoming the foundational architecture for high-performance AI data centers, integrating optical components with silicon chips in the same package t

Lightmatter's collaboration with TSMC on 3D optical engine technology represents a significant advancement in semiconductor innovation. As AI computing demand surges, traditional electrical interconnects face critical power and bandwidth limitations, making silicon photonics a crucial breakthrough s

TSMC unveiled a comprehensive vision for AI-driven semiconductor transformation at its 2026 Technology Forum on May 14. Co-COO and senior VP Kevin Zhang emphasized that the AI revolution is advancing rapidly, positioning TSMC at the forefront of this transformation. The company's strategic focus on