Semiconductor News & Analysis Feed
4023 articles
2026-06-15
www.indexbox.io
2026-06-15
IndexBox
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2026-06-15
www.thefastmode.com
2026-06-15
The Fast Mode
KKR, together with the Kuwait Investment Authority (KIA), NVIDIA and Vistra announced the launch of Helix Digital Infrastructure (Helix), a new company designed to deliver integrated infrastructure at the speed and scale required for hyperscalers to meet accelerating artificial intelligence (AI) demand.
As building AI infrastructure becomes increasingly complex, Helix will serve as a single coor
2026-06-15
simplywall.st
2026-06-15
simplywall.st
Japan/Semiconductors/TSE:6963
Is ROHM (TSE:6963) Quietly Recasting Its Power-Semiconductor Edge Through Targeted SiC Design Wins?
June 15, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
ROHM recently introduced its TSC3PAK surface-mount package for SiC MOSFETs for xEV onboard chargers, electric compressors and industrial power systems, while its 750 V SiC MOSFETs were adopted in battery backup un
2026-06-15
www.morningstar.com
2026-06-15
Morningstar
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Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
Provided by PR Newswire Jun 15, 2026, 9:00:00 AM
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconducto
2026-06-15
www.streetinsider.com
2026-06-15
StreetInsider
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2026-06-15
www.prnewswire.com
2026-06-15
PR Newswire
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
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Rapidus Corporation
Jun 14, 2026, 21:00 ET
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New collaboration provides framework between the Japan government and the UK
TOKYO, June 14, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the UK Semiconduct
2026-06-15
uk.finance.yahoo.com
2026-06-15
Yahoo Finance UK
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Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
PR Newswire
Sun, 14 June 2026 at 6:00 pm GMT-7 3 min read
New collaboration provides framework between the Japan government and the UK
TOKYO, June 14, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it
2026-06-15
www.indexbox.io
2026-06-15
IndexBox
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2026-06-15
digitimes.com
2026-06-15
Nvidia CEO Jensen Huang's recent trip to South Korea put the spotlight on the rivalry between Samsung Electronics and SK Hynix, while memory giant Micron crossed the US$1 trillion market-cap mark for the first time. That shift has also drawn global attention to Micron CEO Sanjay Mehrotra, whose rise began with a string of dramatic visa rejections 50 years ago.
2026-06-15
digitimes.com
2026-06-15
Tsang Yow is preparing to broaden its manufacturing footprint in Malaysia, a move that could help global semiconductor supply chains become more regional, resilient, and tariff-proof. The drivetrain systems maker expects trial production at the new plant before the end of 2026, as demand tied to artificial intelligence and advanced chips reshapes sourcing patterns worldwide.
2026-06-15
digitimes.com
2026-06-15
India sees rising global tech investment as Meta, Reliance and Anthropic deepen AI ties, while EV firms expand, Starlink faces delays, and semiconductor and tablet markets show steady structural growth.
2026-06-15
digitimes.com
2026-06-15
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
INPAQ Technology, a unit of PSA Walsin Technology, reported that revenue and profit in the first quarter of 2026 fell year on year, citing a supply-demand imbalance in the memory market and sharp raw material price increases. The company said it expected a gradual recovery in the second half of 2026 as industry inventories normalized and new products and customers began contributing. INPAQ also ou
2026-06-15
digitimes.com
2026-06-15
Galatek Technologies has opened a manufacturing, assembly, and delivery center in Penang, marking the AI-enabled automation and semiconductor equipment supplier's first manufacturing site in Malaysia.
2026-06-15
digitimes.com
2026-06-15
Taiwan's listed semiconductor and electronics companies posted robust revenue growth in May 2026, with the latest monthly data revealing a widening split between AI infrastructure beneficiaries and legacy consumer electronics players. The five-month cumulative picture through May underscores a structural reordering of the sector's top earners, led by server and AI hardware demand.
2026-06-15
digitimes.com
2026-06-15
Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and i
2026-06-15
digitimes.com
2026-06-15
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical communications market. Taiwanese compound semiconductor suppliers including Visual Photonics Epitaxy (VPEC) and Global Communication Semiconductors (GCS)
2026-06-15
digitimes.com
2026-06-15
Walsin Technology expects the tight supply of passive components could last into 2028, as demand from AI infrastructure, automotive electronics, and future device upgrades lifts orders while memory shortages weigh on shipments across the broader electronics supply chain.
2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-15
digitimes.com
2026-06-15
Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business looks difficult next year, with 2028 emerging as a more likely timeline, Yonhap, ZDNet Korea,and Chosunreported.