Semiconductor News & Analysis Feed
4481 articles
2026-06-09
www.azom.com
2026-06-09
AZoM
From Oxford Instruments
Jun 9 2026
Oxford Instruments, a leading provider of advanced plasma processing solutions for the compound semiconductor industry, today announced its role in supporting ROHM Co., Ltd. as the company transitions 650 V gallium nitride (GaN) power device manufacturing in-house.
ROHM brings 200 mm GaN device production in-house. Image Credit: Oxford Instruments
By leveragin
2026-06-09
www.electronicsmedia.info
2026-06-09
Electronics Media
Nexperia and Semikron Danfoss Explore Strategic Collaboration on SiC Power Modules for Automotive Applications
By Electronics Media -
June 9, 2026
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SiC Power Modules – Nexperia B.V. and Semikron Danfoss GmbH have signed a Memorandum of Understanding (MoU) to explore a strategic collaboration on silicon carbide (SiC)-based power modules for automotive trac
2026-06-09
www.marketscreener.com
2026-06-09
marketscreener.com
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2026-06-09
finance.yahoo.com
2026-06-09
Yahoo Finance
ASML Becomes Europe’s Most Valuable Stock As Valuation And Growth Expectations Soar
Simply Wall St
Tue, June 9, 2026 at 6:21 AM AST 3 min read
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ASML Holding (NasdaqGS:ASML) has become the most valuable European stock ever, setting a
2026-06-09
www.localsyr.com
2026-06-09
WSYR
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2026-06-09
www.engineering.com
2026-06-09
Engineering.com
The buildout starts at 55 MW, expands GAK Sejong and includes HyperCLOVA X, Nemotron and NemoClaw-based services.
NVIDIA and NAVER announced that NAVER will expand sovereign AI infrastructure, starting at 55 megawatts with plans to move to gigawatt scale using the NVIDIA DSX platform to rapidly design, build and scale full-stack, end-to-end AI platforms that can serve enterprises, industries and
2026-06-09
www.tahawultech.com
2026-06-09
TahawulTech.com
CHANNEL, NEWS, VENDOR
Siemens and Infineon collaborate on electrical circuit protection
DANIEL SHEPHERD
4 MINUTES AGO
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Siemens and Infineon Technologies recently entered into a collaboration to help protect electrical supplies in data centres, production facilities and battery storage systems.
The pair are working to provide semiconductor breaker technology, which
2026-06-09
www.trefis.com
2026-06-09
Trefis
Applied Materials Stock Is Defying the Downturn, But What Are You Actually Buying?
June 9th, 2026 by Trefis Team
-49.73%
Downside
492
Market
247
Trefis
AMAT
Applied Materials
The semiconductor giant is riding a powerful AI wave, but its long-term behavior suggests it amplifies your existing market exposure more than it diversifies it.
On its latest earnings call, Applied Materials (AMAT) announc
2026-06-09
manufacturing.economictimes.indiatimes.com
2026-06-09
ET Manufacturing
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2026-06-09
www.benzinga.com
2026-06-09
Benzinga
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2026-06-09
wifinowglobal.com
2026-06-09
Wi-Fi NOW Global
Qualcomm’s new Dragonwing MBM silicon solution combines interactive multimedia with top-tier connectivity & on-device AI
June 9, 2026 | INTELLIGENT CONNECTIVITY | by Claus Hetting, Wi-Fi NOW CEO & Chairman
By Claus Hetting, WiFi NOW CEO & Chairman
It is not often that major chipset vendors introduce an entirely new class of AI-enabled connectivity platforms but Qualcomm did exactly that only tw
2026-06-09
entrepreneur.economictimes.indiatimes.com
2026-06-09
Indiatimes
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2026-06-09
www.engineering.com
2026-06-09
Engineering.com
The architecture uses NeMoClaw, Jetson Thor and IGX Thor for inspection, logistics, energy management and operator support.
Miller Chang, president of Advantech’s Embedded Sector (left), and Deepu Talla, VP and GM of Robotics and Edge AI at NVIDIA (right), announced during the Edge AI conference that the two companies will deepen their collaboration to launch the “AI Factory Brain.”
Advantech ha
2026-06-09
www.designworldonline.com
2026-06-09
Design World
www.designworldonline.com
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2026-06-09
www.semiconductor-today.com
2026-06-09
Semiconductor Today
Navitas introduces isolated through-hole package for 1200–3300V SiC MOSFETs
Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has launched its new UHV‑TO‑247‑4‑ISO package, setting what is claimed to be a new benchmark for high‑performance discrete power devices.
Featuring over 12mm pin-to-pin creepage and greater than 6000V
2026-06-09
mybroadband.co.za
2026-06-09
MyBroadband
mybroadband.co.za
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2026-06-09
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2026-06-09
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2026-06-09
www.electronicsmedia.info
2026-06-09
Electronics Media
ROHM TSC3PAK SiC MOSFET Package Enables High-Efficiency Power Design for EVs
By Electronics Media -
June 9, 2026
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ROHM TSC3PAK SiC MOSFET Package – ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product
2026-06-09
www.msn.com
2026-06-09
MSN
Broadcom (AVGO) has been one of the undisputed champions of the artificial intelligence (AI) boom. As a leading designer of custom AI chips for hyperscale cloud giants, the company has become a cornerstone of the rapidly expanding AI infrastructure market, helping drive its stock nearly 380% higher over the past three years. Yet, despite delivering another standout quarter recently, investors hit
2026-06-09
finance.yahoo.com
2026-06-09
Yahoo Finance
Should You Buy Micron Technology Stock Before June 24, or Is the Semiconductor Sell-Off About to Get Worse?
Anthony Di Pizio, The Motley Fool
Tue, June 9, 2026 at 4:05 AM AST 5 min read
MU
+9.87%
NVDA
+1.73%
AVGO
+2.82%
Micron Technology (NASDAQ: MU) is one of the world's leading suppliers of high-bandwidth memory (HBM) for data centers, an essential component in the artificial intelligence (AI)