Semiconductor News & Analysis Feed
20 articles
2026-08-26
www.newsarticleinsiders.com
2026-08-26
2026-08-25
2026-08-23
2026-08-21
tomshardware.com
2026-08-21
LG Electronics has entered the semiconductor packaging arena by signing a contract with an outsourced semiconductor assembly and test (OSAT) company to supply a maskless laser direct imaging (LDI) lithography tool. This technology enables the creation of metal interconnect patterns in chip packaging
2026-08-21
www.tomshardware.com
2026-08-21
2026-08-20
en.sedaily.com
2026-08-20
2026-08-13
www.koreaherald.com
2026-08-13
SK hynix is set to hold a groundbreaking ceremony on August 27 for its $3.87 billion advanced chip packaging plant in West Lafayette, Indiana, marking a significant step in its U.S. expansion strategy focused on AI chip production. The facility will specialize in high-bandwidth memory (HBM) packagin
2026-08-07
news.google.com
2026-08-07
2026-08-05
www.digitimes.com
2026-08-05
2026-08-02
finance.yahoo.com
2026-08-02
2026-07-31
www.benzinga.com
2026-07-31
TSMC is reportedly developing advanced chip packaging technology to challenge Intel's dominance in the semiconductor industry. This development signals a significant shift in the competitive landscape of the semiconductor sector. While Intel maintains strong position in traditional processor markets
2026-07-31
2026-07-30
seekingalpha.com
2026-07-30
2026-07-30
www.theinformation.com
2026-07-30
2026-07-30
asianews.network
2026-07-30
2026-07-29
2026-07-25
www.kjzz.org
2026-07-25
Amkor's $1.5 billion partnership with NVIDIA represents a significant strategic alliance in the semiconductor supply chain, highlighting the industry's continued investment in advanced chip manufacturing technologies. This collaboration focuses on chip packaging and testing services, with particular
2026-07-24
www.tradingview.com
2026-07-24
NVIDIA and Amkor have signed a multi-year agreement valued at $1.5 billion to expand advanced chip packaging and testing capacity in the United States. The deal supports Amkor's expansion in Arizona and includes joint development of packaging technologies for NVIDIA's AI and accelerated computing pl
2026-07-24
evertiq.com
2026-07-24
NVIDIA and Amkor Technology have signed a $1.5 billion chip packaging agreement to advance technologies such as high-density interconnects and next-generation heterogeneous integration, supporting future AI and accelerated computing platforms. The collaboration emphasizes expanding full turnkey pack
2026-07-24
www.bizjournals.com
2026-07-24