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2026-06-24
www.thediplomat.ro
2026-06-24
The Diplomat Bucharest
HomeNewsGunter Krasser, Infineon Technologies: “Building technology hubs requires talent, collaboration and funding”
Gunter Krasser, Infineon Technologies: “Building technology hubs requires talent, collaboration and funding”
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TECHNOLOGY
PUBLISHED ON
JUNE 24, 2026
BY
PETRE BARAC
Strong university partnerships, thriving technology ecosystems and targeted funding mechanisms are es
2026-06-24
blogs.nvidia.com
2026-06-24
NVIDIA Blog
NVIDIA and AWS Collaborate to Bring AI to Production at Scale
June 23, 2026 by Josiah Byers
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Building AI systems at scale is demanding, requiring low-latency inference, fast vector search, strong GPU price-performance and infrastructure that can grow without multiplying operational complexity.
NVIDIA’s latest work with Amazon Web Services (AWS) addresses each of those constraints. Acro
2026-06-24
digitimes.com
2026-06-24
Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the semiconductor supply chain.
2026-06-23
www.mobihealthnews.com
2026-06-23
MobiHealthNews
www.mobihealthnews.com
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2026-06-23
www.mobihealthnews.com
2026-06-23
MobiHealthNews
www.mobihealthnews.com
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2026-06-23
www.kucoin.com
2026-06-23
KuCoin
AI needs a good "brain" to develop a body.
Article author and source: Semi-Industry Spectrum
Recently, Muxi Co., Ltd. and UBTECH signed a strategic cooperation agreement in Nanjing to jointly establish Xuanxuan Chuangzhi Technology (Wuxi) Co., Ltd., focusing on the research and development and mass production of embodied intelligence edge chips. Muxi is a domestic high-performance GPU company, w
2026-06-23
manilastandard.net
2026-06-23
Manila Standard
TECHNOLOGY
Last updated June 23, 2026, 7:32 PM
Cadence announces collaboration with Intel Foundry to accelerate Intel 14A process optimization for HPC and mobile designs
By Manila Standard - Tech
June 23, 2026, 7:31 PM
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Expanded cooperation spans DTCO, IP readiness and design enablement to advance next-generation customer innov
2026-06-22
www.computerweekly.com
2026-06-22
Computer Weekly
FORMA82 - STOCK.ADOBE.COM
FORMA82 - STOCK.ADOBE.COM
NEWS
HMD Secure, Qualcomm and StreamWIDE forge NR Sidelink collaboration
Partnership unveils NR Sidelink-powered device-to-device communications boasting tech firsts for first responders and critical infrastructure teams operating beyond network coverage
By
Joe O’Halloran, Computer Weekly
Published: 22 Jun 2026 16:22
For first responders in al
2026-06-22
www.thinkgeoenergy.com
2026-06-22
ThinkGeoEnergy
www.thinkgeoenergy.com
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2026-06-22
www.electronicsweekly.com
2026-06-22
Electronics Weekly
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2026-06-22
cryptobriefing.com
2026-06-22
Crypto Briefing
Cisco expands AI infrastructure collaboration with Equinix and Nvidia
The trio is deploying Cisco's Secure AI Factory across Equinix's global network of over 280 data centers, targeting the gap betwee
2026-06-22
news.futunn.com
2026-06-22
富途牛牛
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2026-06-22
www.newelectronics.co.uk
2026-06-22
New Electronics
www.newelectronics.co.uk
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2026-06-19
news.google.com
2026-06-19
marketscreener.com
2026-06-19
digitimes.com
2026-06-19
Samsung Electronics' foundry business has signed a strategic manufacturing collaboration with Claros, a US power-management startup, to produce semiconductors designed to cut energy waste inside AI data centers, according to a Claros announcement and a report by ZDNet Korea.
2026-06-19
www.hpcwire.com
2026-06-19
HPCwire
www.hpcwire.com
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2026-06-19
www.01net.it
2026-06-19
01net
www.01net.it
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2026-06-18
news.google.com
2026-06-18
Business Wire
2026-06-18
stories.prf.org
2026-06-18
Purdue Research Foundation
This article has been translated by Google Translate. To read the original article, click here.
To deepen Taiwan-US cooperation in science and technology, talent and industry, a delegation from Purdue University visited the Ministry of Education and the Ministry of Economic Affairs on June 17 and had in-depth exchanges with GeChi Compound Semiconductor on issues such as third-generation semicondu
2026-06-18
www.prnewswire.com
2026-06-18
PR Newswire
Visteon Introduces D6Sigma, a New Edge AI Product Line for Industrial Automation, Developed in Close Collaboration with Qualcomm
NEWS PROVIDED BY
Visteon Corporation
Jun 18, 2026, 09:00 ET
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New product line brings real-time vision AI to the factory floor — powered by Visteon's CognitoAI™ -IoT platform and Qualcomm Dragonwing™ AI-enabled processors.
VAN BUREN TOWNSHIP,