Semiconductor News & Analysis Feed

The artificial intelligence (AI) industry is expanding at a pace that the physical world cannot match, and the gap between digital demand and real-world supply is widening across every layer of the infrastructure stack, from power generation to chip manufacturing to data center construction. That was the assessment of Sachin Hindupur, global strategy and operations leader at AMD, in a presentation

As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl

Taiwan's semiconductor and electronics supply-chain companies continued to post generally firm sales in May, according to monthly revenue data and company disclosures, with the strongest accumulated growth concentrated in AI-linked logic, testing, substrate, and copper-clad laminate suppliers.

AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end ABF substrate market. HVLP4 copper foil is set to become the next constraint in the second half of 2026.

GEM Terminals reported consolidated revenue of about NT$428 million (US$13.6 million) in May 2026, up 71.83% year-over-year from NT$249 million, saying expanding global investment in AI infrastructure drove a surge in demand for specialty copper materials used in cooling applications. The firm linked the month's performance to rising cooling needs at servers and data centers as computing density i

Co-Tech said on June 8, 2026, that Nvidia has directly approached it to discuss long-term capacity planning for high-end HVLP4 copper foil, as AI GPU and ASIC demand accelerates and a structural supply bottleneck looms in 2026. Chairman Frank Lee said the market could face a 15–25% supply shortfall in 2026, setting up a two-to-three year upcycle in prices.

US chipmaker Marvell took a more visible stance at Computex 2026, with CEO Matt Murphy delivering a keynote speech and senior executives visiting Taiwan to lay out the company's outlook for AI data center connectivity technology and market opportunities.

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Sector Reaction: Social media participants observed a notable pullback in Applied Optoelectronics shares after NVIDIA leadership suggested extended use of copper in data centers. Analysts on the platform clarified that the remarks addressed supply sequencing rather than a shift away from optics. They pointed to NVIDIA's own investments in related firms as evidence of ongoing commitment to the opti

Marvell Technology used its first-quarter fiscal 2027 earnings call to detail accelerating progress across optical, copper, and silicon photonics-based connectivity, signaling that AI infrastructure is shifting from compute-centric bottlenecks toward networking-driven architectures. The company's expanded interconnect portfolio, new silicon photonics acquisition, and emerging scale-up switch progr

Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board

Optical communication stocks surged on May 26 due to advancements in GPU-HBM integration using fiber optic interconnects. This innovative solution overcomes physical limitations of traditional 2.5D packaging by decoupling compute and memory units, allowing greater HBM capacity and improved thermal management. If successful, it will expand optical interconnects beyond data centers and benefit silic