Semiconductor News & Analysis Feed

20 articles

2026-10-09

US DOW awards conditional $1.5bn loan to bandgap semiconductor firm - gasworld

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www.gasworld.com 2026-10-09

2026-10-09

Wolfspeed Receives Conditional $1.5 Billion 30-Year Loan Commitment From U.S. Department Of War - Pulse 2.0

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pulse2.com 2026-10-09

2026-10-08

US military backs $1.5B conditional loan for advanced defense chips - Interesting Engineering

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interestingengineering.com 2026-10-08

2026-10-08

Wolfspeed Announces Conditional 30-Year, $1.5 Billion Loan Commitment from U.S. Department of War to Advance Domestic Wide Bandgap Supply Chain - Business Wire

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news.google.com 2026-10-08

2026-10-01

Nvidia Knows It Could Trigger a Credit Risk Shock and Collapse Markets - Yahoo Finance

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finance.yahoo.com 2026-10-01

2026-09-30

Nuvacore’s WarpCore Ditches The ISA-First Playbook, Building CPU Silicon Before Deciding On x86, Arm, Or RISC-V - Wccftech

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wccftech.com 2026-09-30

2026-09-30

Apple A20 Pro ditches PoP memory packaging for WMCM

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digitimes.com 2026-09-30

2026-09-30

Samsung Executive: HBM Expected to Account for Nearly 30% of Global DRAM Capacity Next Year, Pressuring Traditional DRAM Supply - news.futunn.com

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news.futunn.com 2026-09-30

2026-09-29

Wells Fargo & Co comments on rumors of Taiwan Semiconductor's 2nm capacity expansion: semiconductor equipment suppliers may see additional upside. - 富途牛牛

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news.futunn.com 2026-09-29

2026-09-28

Oddo BHF Lifts Infineon to Outperform as Chipmaker Trades Commodity Memory for AI Data Center Power - AD HOC NEWS

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www.ad-hoc-news.de 2026-09-28

2026-09-28

Every 2027 iPhone could ditch Qualcomm, but Apple can't escape it - PhoneArena

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www.phonearena.com 2026-09-28

2026-09-27

Taiwan's Chiayi Science Park Phase 3 Expansion Kicks Off; TSMC Reportedly Plans 5 Additional Advanced Packaging Plants - finance.biggo.com

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finance.biggo.com 2026-09-27

Taiwan's National Science and Technology Council has formally opened the Chiayi Science Park Phase 3 expansion for public comment, with supply-chain sources indicating TSMC intends to add five more advanced packaging facilities at the site. If realized, TSMC's packaging footprint in Chiayi would dou

Advanced Packaging TSMC Chiayi Science Park Capacity Expansion 2.5D Packaging 3D Packaging CoWoS Semiconductor Supply Chain

2026-09-27

Infineon Cashes Out of Commodity Memory to Double Down on AI Power - AD HOC NEWS

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www.ad-hoc-news.de 2026-09-27

Infineon's $1.12 billion divestiture of its NOR-Flash and F-RAM portfolio to Winbond Electronics represents a deliberate strategic pivot rather than a simple cost-reduction exercise. The German chipmaker is trading a business long squeezed by relentless price competition in commodity memory for conc

Infineon Winbond NOR Flash F-RAM Silicon Carbide AI Data Center Power Semiconductors M&A

2026-09-27

Beijing escalates domestic chip drive with Broadcom audits

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digitimes.com 2026-09-27

2026-09-25

Micron Stocks Gain While CXMT Raises the Commodity Threat - Yahoo Finance Singapore

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sg.finance.yahoo.com 2026-09-25

2026-09-25

Micron Stocks Gain While CXMT Raises the Commodity Threat - TradingView

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www.tradingview.com 2026-09-25

2026-09-24

AWS and NVIDIA Scale AI Infrastructure With 2 Million Additional GPUs - Cloud Wars

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news.google.com 2026-09-24

2026-09-23

Semiconductor Rally Faces Crosscurrents From FX and Credit - Investing.com

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www.investing.com 2026-09-23

2026-09-23

Congress Should Make the CHIPS Act’s Investment Tax Credit Permanent | Blogs | Sep 22, 2026 - Information Technology and Innovation Foundation

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itif.org 2026-09-23

2026-09-22

Samsung Electronics' DRAM Expansion Won't Ease Commodity Shortage — Price Rally Seen Prolonged - finance.biggo.com

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news.google.com 2026-09-22

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