Semiconductor News & Analysis Feed

964 articles
2026-05-27
cryptobriefing.com 2026-05-27 Crypto Briefing
Micron jumps 16% after UBS triples price target to $1,625 on AI memory demand UBS analyst Timothy Arcuri tripled his Micron price target, citing long-term supply agreements and AI-driven demand for hi
2026-05-26
qz.com 2026-05-26 qz.com
MARKETS Micron stock surges after UBS more than triples its price target, citing AI UBS raised its target on Micron to a Street-high $1,625 from $535, arguing AI has structurally changed the memory market By Cris Tolomia Share to X Share to Facebook Share to Reddit Share to Email Share to Link Published 38 minutes ago | Updated 32 minutes ago Add Quartz on Google Bloomberg / Getty Images Shares
2026-05-26
qz.com 2026-05-26 qz.com
MARKETS Micron stock surges after UBS more than triples its price target, citing AI UBS raised its target on Micron to a Street-high $1,625 from $535, arguing AI has structurally changed the memory market By Cris Tolomia Share to X Share to Facebook Share to Reddit Share to Email Share to Link Published 23 minutes ago Add Quartz on Google Bloomberg / Getty Images Shares of Micron $MU +14.28% Tec
2026-05-26
finance.yahoo.com 2026-05-26 Yahoo Finance
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2026-05-26
www.citybiz.co 2026-05-26 citybiz
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2026-05-26
www.thestreet.com 2026-05-26 thestreet.com
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2026-05-26
newsroom.st.com 2026-05-26 STMicroelectronics
700V PowerGaN devices improve energy efficiency and enable more compact power designs for AI servers, robotics, industrial systems and advanced consumer applications including home appliances Alexander Jurman Technical Media Relations Tel. +420602748611 alexander.jurman@st.com To receive frequent updates via email, subscribe to our press releases. New gallium nitride (GaN)-based power semicondu
2026-05-26
simplywall.st 2026-05-26 simplywall.st
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2026-05-26
www.investing.com 2026-05-26 Investing.com
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2026-05-26
ca.investing.com 2026-05-26 Investing.com Canada
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2026-05-26
www.tradingview.com 2026-05-26 TradingView
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2026-05-26
www.msn.com 2026-05-26 MSN
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2026-05-26
finance.yahoo.com 2026-05-26 Yahoo Finance
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2026-05-26
www.digitimes.com 2026-05-26 digitimes
Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV technologies to reduce energy consumption per wafer at the process level,... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time the
2026-05-26
stocktwits.com 2026-05-26 Stocktwits
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2026-05-26
digitimes.com 2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com 2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com 2026-05-26
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks and tighter supply expected through 2027. The developments could reshape supply chains for servers, data centers, and high-power consumer electronics worldwide, and accelerate global investment in components.
2026-05-26
digitimes.com 2026-05-26
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter to unveil its latest laser product, Guide DR. To advance its 3D-stacked silicon photonics engine, Lightmatter is also working closely with TSMC using its Compact Universal Photonic Engine (COUPE) platform.
2026-05-26
digitimes.com 2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.