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2026-06-10
Tom's Hardware
Tech Industry
Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration
News-analysis
By Luke James published 3 days ago
TSMC's CoWoS lines are sold out through 2027, and Intel's EMIB is the only credible second source.
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