Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration - Tom's Hardware

According to The Information, Google has reportedly placed an order with Intel for over three million TPUs in 2028, marking a significant endorsement of Intel's advanced packaging technology. This mov... Read original →

Google’s commitment to Intel’s packaging is a strategic hedge against TSMC’s CoWoS bottleneck. If SK hynix validates EMIB-HBM integration, AI ASICs will increasingly favor cost-efficient heterogeneous integration over bandwidth-heavy GPUs. U.S. CHIPS Act incentives support this shift, yet Intel’s yield consistency remains a critical supply chain vulnerability. NVIDIA may be forced to explore EMIB to bypass CoWoS constraints through 2027, while AMD and Broadcom could leverage the tension to renegotiate TSMC allocation terms. Within 18 months, EMIB-T’s readiness for HBM4/5 could let Intel carve out a high-margin advanced packaging franchise—turning its foundry losses into a strategic foothold—provided memory vendors deliver timely validation.