Semiconductor News & Analysis Feed
3130 articles
2026-05-28
digitimes.com
2026-05-28
Passive component manufacturer Yageo held its 2026 annual shareholders meeting on May 27. In a post-meeting interview, chairman Pierre Chen confirmed that the world's two largest multilayer ceramic capacitor (MLCC) makers, Japan's Murata Manufacturing and South Korea's Samsung Electro-Mechanics (Semco), have recently issued price increase notices to customers and distributors.
2026-05-28
digitimes.com
2026-05-28
Chunghwa Precision Test Tech. completed its board election at the 2026 annual shareholders' meeting on May 27 as the semiconductor test interface maker prepared for rising AI chip demand and a planned capacity expansion over the next two to three years. The company announced the reappointment of four board members and the retention of three independent directors as it outlined near-term production
2026-05-28
digitimes.com
2026-05-28
Qualcomm has reportedly landed more than one ASIC customer, with a separate project for a US cloud service provider also taking shape, according to industry sources. The development follows reports from Bloombergand other media that ByteDance, the developer of TikTok, is Qualcomm's first major client for its custom chip push.
2026-05-28
digitimes.com
2026-05-28
Synopsys said growing demand for artificial intelligence chips from semiconductor companies and hyperscale data center operators is driving broader adoption of its electronic design automation (EDA), hardware-assisted verification, and intellectual property (IP) products, supporting a higher fiscal 2026 revenue outlook and reinforcing the company's position in AI-related semiconductor development.
2026-05-28
digitimes.com
2026-05-28
On May 27, Marvell Technology reported record revenue in the fiscal first quarter of 2027 and raised its long-term outlook, citing accelerating demand for AI-related data center infrastructure, particularly in high-speed interconnect, Ethernet switching, and custom silicon solutions used in hyperscale cloud deployments.
2026-05-28
digitimes.com
2026-05-28
Sino-American Silicon Products (SAS) held its shareholders meeting on May 26 and completed a full board overhaul, with founder Mingguang Lu stepping down as a director and Hsiu-lan Hsu being re-elected chairwoman. Lu will continue supporting the group as honorary chairman as SAS deepens its generational transition and diversified growth strategy.
2026-05-28
digitimes.com
2026-05-28
Synopsys said the rise of agentic artificial intelligence and the integration of Ansys are creating new growth opportunities across electronic design automation (EDA) and simulation software, as semiconductor and industrial customers adopt more complex AI-driven engineering workflows.
2026-05-28
digitimes.com
2026-05-28
During the 2026 Europe Day Dinner, Taiwanese President Ching-te Lai referenced how coal and steel formed the foundation of peace in Europe, comparing that to how semiconductors and AI shape global prosperity and democratic security for Taiwan. He said Taiwan's semiconductor ecosystem integrates critical technologies from leading European companies, praising the nature of like-minded partners worki
2026-05-28
digitimes.com
2026-05-28
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
2026-05-28
digitimes.com
2026-05-28
SK Hynix is using Big Tech's rush to secure artificial intelligence (AI) memory supply as leverage for tougher long-term contracts, while resisting funding structures that could give major customers influence over its fabs or equipment.
2026-05-28
digitimes.com
2026-05-28
Solidigm, the enterprise storage brand under SK Hynix, announced a leadership reshuffle this spring, naming two executives as co-chief executive officers to divide responsibilities between global operations and commercial growth. One co-CEO was appointed in March 2026, and the other took office on May 1, with leadership stating the change aims to accelerate product execution and business performan
2026-05-28
digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-28
digitimes.com
2026-05-28
As Moore's Law nears its limits, Huawei is promoting its "Tau (τ) Law" as a post-Moore chip framework that shifts the focus from nanometer process nodes to shorter signal transmission times across electronic systems.
2026-05-28
digitimes.com
2026-05-28
South Korean AI chip startup FuriosaAI has announced a partnership with Broadcom to develop a next-generation AI inference platform aimed at large-scale agentic AI deployments, as demand grows for infrastructure optimized for AI reasoning and high-volume inference workloads.
2026-05-28
digitimes.com
2026-05-28
Nvidia CEO Jensen Huang hosted another "trillion-dollar dinner" at Juan Yau Restaurant in Taipei, Taiwan, on May 28, with chairmen and presidents from multiple Taiwanese artificial intelligence (AI) server and semiconductor supply chain companies attending and posing for group photos.
2026-05-28
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2026-05-28
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2026-05-28
finance.yahoo.com
2026-05-28
Yahoo Finance
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2026-05-28
www.fool.com
2026-05-28
The Motley Fool
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2026-05-28
pulse2.com
2026-05-28
Pulse 2.0
Qualcomm and HUMAIN announced a memorandum of understanding to collaborate on next-generation AI data centers, cloud-to-edge infrastructure, and hybrid AI services in Saudi Arabia and global markets. The agreement was signed during the Saudi-US Investment Forum in Riyadh during the visit of U.S. President Donald Trump to Saudi Arabia.
Under the agreement, Qualcomm Technologies and HUMAIN plan to
2026-05-28
finance.yahoo.com
2026-05-28
Yahoo Finance
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