Semiconductor News & Analysis Feed

54 articles
2026-06-17
www.indexbox.io 2026-06-17 IndexBox
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2026-06-16
digitimes.com 2026-06-16
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry sources, who say the timeline is likely premature and that the company remains focused on evaluating multiple advanced-packaging options.
2026-06-15
www.megabites.com.ph 2026-06-15 megabites.com.ph
Cadence announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® Tensilica® Vision DSP IP to accelerate signal processing in its 4D LiDAR systems—enabling flexible and scalable solutions for industrial robotics and automotive applications. This design win marks a significant step in delivering high-performance, low-power lidar systems optimized for rea
2026-06-15
www.indexbox.io 2026-06-15 IndexBox
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2026-06-12
www.electronicsforyou.biz 2026-06-12 Electronics For You BUSINESS
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2026-06-12
digitimes.com 2026-06-12
SK Hynix's latest fire at its Cheongju, South Korea, campus has again disrupted operations at a key memory-chip site and prompted evacuations of thousands of workers. The incident adds to a series of recent accidents, raising fresh safety concerns for semiconductor plants worldwide that depend on hazardous gases and chemicals.
2026-06-11
www.klsescreener.com 2026-06-11 KLSE Screener
This article first appeared in The Edge Malaysia Weekly on June 1, 2026 - June 7, 2026 FOR years, outsourced semiconductor assembly and test (OSAT) providers were viewed as the lower-margin, labour-intensive end of the semiconductor value chain — far removed from the prestige of chip design and wafer fabrication. As artificial intelligence (AI), electric vehicles, data centres and high-performan
2026-06-09
www.trendforce.com 2026-06-09 TrendForce
[News] Intel Foundry Gains Momentum as Google Reportedly Orders 3M TPUs, NVIDIA Evaluates 18A for Multi-Die GPUs 2026-06-09 Semiconductors editor News Please note that this article cites information from The Information, Reuters, The Bull.com, Guru Focus, Wccftech, Futu News, Commercial Times, and Tom’s Hardware. Amid mounting capacity constraints and a widening shift among leading AI pl
2026-06-09
digitimes.com 2026-06-09
Passive component prices are staying elevated as AI continues to drive demand, with industry sources saying pricing in 2026 will remain at high levels. Panasonic is set to launch a new round of price increases in July, mainly for its SP-Cap capacitor products, with hikes ranging from 5% to 30% depending on the specification.
2026-06-08
247wallst.com 2026-06-08 24/7 Wall St.
A holder who started Friday, June 5, 2026 with $10,000 in ProShares Ultra Technology (NYSEARCA:ROM) ended the day with about $8,655. The fund opened at $161.98 and closed at $140.20, a single-session loss of 13.45%. Over the same five trading days, ROM gave back 11.8%, with the week starting at $158.95. Those numbers are what a 2x daily tech ETF does on the worst day the sector has had in over a y
2026-06-07
www.benzinga.com 2026-06-07 Benzinga
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2026-06-07
digitimes.com 2026-06-07
Transcend Information said revenue for April and May combined has already surpassed its first-quarter total, as tight memory supply and elevated prices continue to lift sales at the Taiwan-based memory module maker.
2026-06-05
news.google.com 2026-06-05 Yahoo Finance
2026-06-05
eetimes.com 2026-06-05
Indian startup Netrasemi launched the A2000 AI chip built on a 12-nm technology node.
2026-06-04
news.google.com 2026-06-04 AppleInsider
2026-06-04
www.01net.it 2026-06-04 01net
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2026-06-03
www.standard-journal.com 2026-06-03 standard-journal.com
AP JEDEC® Releases New SiC Guidelines to Improve Reliability and Evaluation in Power Electronics Business Wire 9 hrs ago 0 Facebook Twitter Email Facebook Twitter Email Print Copy article link Save ARLINGTON, Va.--(BUSINESS WIRE)--Jun 3, 2026-- JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announced the publication of JEP
2026-06-03
news.google.com 2026-06-03 Business Wire
2026-06-03
finance.yahoo.com 2026-06-03 Yahoo Finance
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2026-06-03
uk.finance.yahoo.com 2026-06-03 Yahoo Finance UK
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